Semiconductor Chip Conducting Layer EMI Shielding
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Solution Overview
Problem
Semiconductor device manufacturers face challenges in reducing electromagnetic interference (EMI) and packaging costs while enhancing semiconductor chip performance, as existing methods for EMI shielding and antenna integration are costly and inefficient.
Innovation Solution
The use of an electrically conducting layer applied over the semiconductor chip, which serves as both an EMI shielding layer and an antenna, connected to the chip electrode via an electrical contact area, utilizing techniques such as chemical vapor deposition, physical vapor deposition, or lamination to reduce costs and improve performance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If traditional EMI shielding and antenna structures are used in semiconductor devices, then EMI protection and antenna functionality are achieved, but manufacturing cost increases
Solution Approach 1:
The patent combines EMI shielding layer and antenna structure into a single integrated component. The conducting layer serves dual functions: shielding the semiconductor chip from electromagnetic interference while simultaneously acting as an antenna for wireless communication, eliminating the need for separate EMI shielding and antenna components
Solution Approach 2:
The conducting layer is designed to perform multiple functions simultaneously. It provides EMI shielding protection while also serving as an operational antenna for wireless signals, making a single component universally functional for both protection and communication purposes
2Reliability
If traditional EMI shielding and antenna structures are used in semiconductor devices, then EMI protection and antenna functionality are achieved, but device complexity increases
Solution Approach 1:
The patent merges the EMI shielding layer and antenna structure into one integrated conducting layer, reducing the number of discrete components and simplifying the overall device structure while maintaining both EMI protection and antenna functionality
3Reliability
If conducting layers are applied over the semiconductor chip for EMI shielding, then EMI protection is provided, but manufacturing process complexity increases
Solution Approach 1:
The conducting layer is applied to the semiconductor chip before packaging, allowing the EMI shielding and antenna functionality to be integrated into the chip structure itself. This preliminary application simplifies the overall manufacturing process by eliminating subsequent steps for adding separate shielding and antenna components
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach effectively reduces EMI and integrates antenna functionality while lowering manufacturing costs by using the electrically conducting layer to shield the semiconductor chip and provide electromagnetic radiation coupling, enhancing overall chip performance and efficiency.
Implementation Method 1
utilizing techniques such as chemical vapor deposition, physical vapor deposition, or lamination
Implementation Method 2
utilizing techniques such as chemical vapor deposition, physical vapor deposition, or lamination
Implementation Method 3
Electrically conducting layers may be used in semiconductor devices as antenna structures or for EMI shielding
Implementation Method 4
The electrically conducting layer 20 may be used as an antenna or for EMI shielding
Data Source
AI summary
A semiconductor device includes a semiconductor chip having a first main surface, a second main surface opposite to the first main surface, and a side wall surface. An electrical contact area is exposed at the side wall surface of the semiconductor chip. An electrically conducting layer covers at least partially the second main surface and the electrical contact area.