Semiconductor Chip Conductive Layer ESD Shielding

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Solution Overview

Problem

In the production of semiconductor devices, electrostatic discharges (ESD) can damage semiconductor chips, and they are vulnerable to electromagnetic radiation, which existing methods fail to adequately protect.

Innovation Solution

A workpiece comprising semiconductor chips with an electrically conducting layer on their second main surface and side faces, embedded in a molding compound, which provides electrostatic discharge protection and electromagnetic shielding.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Productivity

If wafer molding process is used to embed semiconductor chips in plastic molding compound, then manufacturing efficiency is improved, but electrostatic discharge damage and electromagnetic radiation vulnerability occur

Engineering Contradiction:

Improvemanufacturing efficiencyVSAvoidprotection against electrostatic discharge and electromagnetic radiation

Core Design Contradiction:

ProductivityVSReliability

Solution Approach 1:

The patent applies composite materials by combining the plastic molding compound with an electrically conducting layer to create a multi-layer protective structure. The molding compound provides mechanical support and encapsulation, while the conducting layer adds electrostatic discharge protection and electromagnetic shielding capabilities, resolving the contradiction between manufacturing efficiency and reliability.

Inventive Principle:

Principle #40Composite materials

Solution Approach 2:

The electrically conducting layer serves as an intermediary element between the semiconductor chips and the external environment. It acts as a mediator that dissipates electrostatic charges and blocks electromagnetic radiation before they can reach the vulnerable semiconductor chips, while allowing the wafer molding process to continue efficiently.

Inventive Principle:

Principle #24Intermediary (Mediator)

2Device complexity

If semiconductor chips are embedded in plastic molding compound without additional protection, then device complexity is reduced, but vulnerability to electrostatic discharge and electromagnetic radiation increases

Engineering Contradiction:

Improvestructure simplicityVSAvoidelectrostatic discharge and electromagnetic radiation vulnerability

Core Design Contradiction:

Device complexityVSObject-affected harmful factors

Solution Approach 1:

The patent merges the protective function with the existing molding compound structure by adding a conducting layer to the encapsulation process. This integration approach provides ESD and electromagnetic protection without requiring separate protective components or complex additional structures, maintaining simplicity while enhancing protection.

Inventive Principle:

Principle #5Merging (Combining)

3Reliability

If complex protected environments are used during processing, then reliability is improved, but manufacturing complexity and cost increase

Engineering Contradiction:

Improveprotection during processingVSAvoidprocessing environment complexity

Core Design Contradiction:

ReliabilityVSDevice complexity

Solution Approach 1:

The patent implements preliminary action by incorporating the electrically conducting layer into the molding compound before the semiconductor chips are fully encapsulated. This pre-established protective barrier eliminates the need for complex protected processing environments, as the chips are already shielded during manufacturing operations.

Inventive Principle:

Principle #10Preliminary action

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The solution effectively prevents electrostatic damage and shields semiconductor chips from electromagnetic interference, reducing the need for complex protected environments during processing and enabling efficient discharge of electrostatic charges.

Implementation Method 1

electrostatic discharges (ESD) may occur, and may cause damage to the semiconductor chips or even their destruction

Methodology Applied

Scientific EffectElectrostatic discharge: Electrostatic Discharge

Implementation Method 2

the semiconductor chips of semiconductor devices should be protected from disturbing influences of electromagnetic radiation

Methodology Applied

Scientific EffectElectromagnetic shielding: Faraday Cage

Data Source

PatentUS7687895B2Workpiece with semiconductor chips and molding, semiconductor device and method for producing a workpiece with semiconductors chips

Publication Date: 2010.03.30 TAHOE RES LTD

AI summary

A workpiece has at least two semiconductor chips, each semiconductor chip having a first main surface, which is at least partially exposed, and a second main surface. The workpiece also includes an electrically conducting layer, arranged on the at least two semiconductor chips, the electrically conducting layer being arranged at least on regions of the second main surface, and a molding compound, arranged on the electrically conducting layer. In the molding compound a contact via is arranged.