Semiconductor Chip Conductive Member Protrusion Stress Distribution
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing semiconductor devices face challenges in effectively cooling semiconductor chips and preventing breakage at the boundaries between the chips and electrically conductive members, leading to potential failures due to thermal stress and mechanical strain.
Innovation Solution
The semiconductor device incorporates a semiconductor chip with first and second electrode surfaces covered by electrically conductive members, a resin sealing member that distributes stress among the chip and conductive members, and specific geometrical configurations of the conductive members to enhance cooling and mechanical bonding, thereby reducing the risk of breakage.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If electrically conductive members are used to connect semiconductor chip surfaces, then electrical connection is achieved, but thermal stress and mechanical strain cause breakage at boundaries
Solution Approach 1:
The patent changes the geometric parameters of the electrically conductive members, specifically creating protrusions that extend beyond the chip surfaces. This geometric modification allows the conductive members to overlap when chips are joined, creating a larger bonding area and distributing mechanical stress more effectively, thereby preventing breakage at the boundaries between chips and conductive members.
Solution Approach 2:
The electrically conductive members are pre-formed with protrusions before chip assembly. These protrusions are designed in advance to overlap with corresponding protrusions from opposing chips, establishing a predetermined stress-distribution mechanism that prevents breakage during operation. The preliminary geometric configuration ensures proper alignment and stress distribution before the chips are actually joined.
2Reliability
If electrically conductive members cover electrode surfaces, then electrical connection is improved, but cooling effectiveness is reduced
Solution Approach 1:
The electrically conductive members are designed with localized protrusions that extend only at specific regions beyond the chip surfaces, rather than covering the entire surface uniformly. This local quality approach allows the conductive members to provide electrical connection at the electrode surfaces while leaving other areas exposed for thermal management. The protrusions are strategically positioned to maintain both electrical functionality and thermal dissipation.
3Strength
If sealing member fixes all surfaces of conductive members, then mechanical strength is improved, but cooling capability is reduced
Solution Approach 1:
The sealing member is designed to fix only specific portions of the electrically conductive members, specifically the regions that do not require thermal exposure. The protrusions of the conductive members that need to remain exposed for cooling are left unfixed by the sealing member. This selective fixation approach allows the sealing member to provide mechanical strength where needed while preserving cooling capability at critical thermal management locations.
Solution Approach 2:
The fixation relationship between the sealing member and conductive members is segmented rather than uniform. The sealing member creates discrete fixation points at specific locations on the conductive members, leaving other segments (particularly the protruding portions) unfixed and exposed. This segmentation allows simultaneous achievement of mechanical bonding strength at fixed points and thermal dissipation at unfixed exposed surfaces.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration effectively cools the semiconductor chip and distributes stress, reducing the likelihood of breakage and improving the reliability of the semiconductor device by managing thermal expansion and mechanical loads.
Implementation Method 1
the first and second electrically conductive (metallic) members covering the first and second electrode surfaces respectively as seen in the thickness direction to be electrically connected to the first and second electrode surfaces respectively... the semiconductor chip can be effectively cooled
Implementation Method 2
a sealing member (whose main component is a (synthetic) resin) fixed to at least a part of each of the semiconductor chip, first electrically conductive member and second electrically conductive member, a stress in the semiconductor device is distributed among the sealing member, semiconductor chip, first electrically conductive member and second electrically conductive member
Data Source
AI summary
A semiconductor device has a semiconductor chip including first and second surfaces opposed to each other in a thickness direction of the semiconductor chip, wherein the first and second surfaces include first and second electrode surfaces respectively, and first and second electrically conductive members covering the first and second electrode surfaces respectively as seen in the thickness direction to be electrically connected to the first and second electrode surfaces respectively.