Optoelectronic Semiconductor Chip Contact Segmentation
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Solution Overview
Problem
Optoelectronic semiconductor chips face inefficiencies in light out-coupling due to shading and absorption by contact webs, leading to reduced LED efficiency and voltage drops across the chip surface.
Innovation Solution
The implementation of a metal contact material and conductive connection on the radiation out-coupling side, with a functional division to optimize current injection and distribution, using reflective materials to minimize absorption and enhance light reflection, and the use of dielectric layers to reduce optical losses.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If contact webs are applied to the semiconductor layer sequence for current injection, then electrical properties are optimized, but light absorption and shading occur reducing LED efficiency
Solution Approach 1:
The contact structure is segmented into two separate components: contact material for current injection and conductive connection for current distribution. This segmentation allows the contact material to be optimized for electrical contact while the conductive connection can be optimized for light transparency, resolving the contradiction between electrical performance and optical loss.
Solution Approach 2:
The harmful function of the contact web (light absorption) is extracted and separated from the useful function (current injection). By taking out the current distribution function into a separate conductive connection layer, the contact material can be minimized and optimized solely for electrical contact, reducing light absorption while maintaining electrical properties.
2Reliability
If dense network of contact webs is used for optimized electrical properties, then current injection is improved, but shading and absorption increase reducing light out-coupling efficiency
Solution Approach 1:
The contact structure is divided into contact material applied directly to the semiconductor layer sequence for current injection, and a separate conductive connection layer for current distribution. This allows the contact material to be sparse and optimized for electrical contact, while the conductive connection can be designed with light transparency in mind, resolving the contradiction between electrical optimization and light out-coupling efficiency.
Solution Approach 2:
Different regions and layers are assigned different qualities: the contact material has high electrical conductivity for current injection, while the conductive connection layer has optimized light transparency. This local quality differentiation allows each component to be optimized for its primary function without compromising the other, addressing the contradiction between electrical properties and light out-coupling efficiency.
3Reliability
If contact material is applied for current injection, then electrical contact is achieved, but voltage drop occurs due to finite conductivity
Solution Approach 1:
The contact structure is segmented into contact material for current injection and conductive connection for current distribution. The conductive connection layer is designed with high electrical conductivity to minimize voltage drop during current distribution, while the contact material focuses on achieving good electrical contact with the semiconductor layer sequence. This segmentation allows optimization of each component for its specific function, reducing overall voltage drop while maintaining effective current injection.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach results in improved light out-coupling efficiency, reduced absorption, and a more homogeneous current distribution, leading to increased overall efficiency and reduced voltage drops across the chip surface.
Implementation Method 1
using reflective materials to minimize absorption and enhance light reflection
Implementation Method 2
the use of dielectric layers to reduce optical losses
Data Source
AI summary
An optoelectronic semiconductor chip, comprising: a radiation out-coupling side (102, 910); a contact connection (104, 1000); a metal contact material (210, 912) applied to the radiation out-coupling side (102, 910) and a metal conductive connection (106, 500, 914) applied to the contact material (210, 912) and which is connected to the contact connection (104, 1000).


