Semiconductor Chip Cooling via Internal Fluid Channels
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Solution Overview
Problem
Existing cooling techniques for semiconductor chips face limitations in heat transfer due to constrained flux areas, chip-to-board bonds carrying both heat and current, sensitivity to defects, and heat having to pass through the entire bulk region, which impairs performance and can cause damage.
Innovation Solution
A method involving etching a continuous channel into the bulk region of the semiconductor chip to facilitate the flow of a cooling fluid, increasing the effective surface area for heat transfer and allowing the chip-to-board bond to conduct only current, while maintaining a cooler bond area and reducing distance to active device regions.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If heat is conducted away through the chip-to-board bond, then heat transfer occurs, but the bond must carry both heat and current which creates conflicting constraints
Solution Approach 1:
The invention separates the heat conduction path from the electrical connection path by introducing dedicated thermal vias and heat sinks, while electrical connections are maintained through separate bond wires or leads. This segmentation eliminates the conflicting constraints of carrying both heat and current through the same bond.
Solution Approach 2:
The invention introduces an intermediary thermal management structure (heat sink with thermal vias) between the chip and the board, which handles heat dissipation separately from the electrical connection path, thereby resolving the conflicting requirements.
2Area of stationary object
If the flux area is constrained to the area of the chip, then the bonding area is minimized, but heat transfer is limited
Solution Approach 1:
The invention extends the heat transfer area into the vertical dimension by creating arrays of thermal vias that penetrate through the chip and board thickness, effectively increasing the heat transfer area without increasing the lateral bonding footprint.
Solution Approach 2:
The invention utilizes an array of porous or hollow thermal vias filled with high-conductivity material, creating a three-dimensional heat transfer network that significantly increases the effective heat transfer area within the constrained bonding region.
3Temperature
If the chip is placed in intimate contact with a radiator, then heat dissipation is improved, but sensitivity to defects and impurities increases
Solution Approach 1:
Instead of relying on a single large-area intimate contact interface that is sensitive to defects, the invention segments the heat transfer path into multiple parallel thermal via channels, so that local defects in one channel do not compromise the entire heat dissipation system.
Solution Approach 2:
The invention applies different material properties and structural characteristics to different regions of the heat transfer path, with high-conductivity materials in thermal vias and optimized interface layers at contact points, reducing the impact of local defects on overall performance.
4Device complexity
If heat passes through the entire bulk region of the chip, then the chip structure is simple, but heat transfer at active regions is limited
Solution Approach 1:
The invention incorporates thermal management features (thermal vias, heat sinks) directly into the chip structure during manufacturing, creating pre-established heat extraction pathways that immediately address hot spots at active regions before heat can accumulate and cause damage.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach significantly enhances heat transfer efficiency, reduces the risk of bond failure, and effectively cools active regions within the chip, improving overall performance and reliability.
Implementation Method 1
Heat transferred to the radiator from the chip may be dissipated by convection (e.g., using a fan) or radiation
Implementation Method 2
Heat transferred to the radiator from the chip may be dissipated by convection (e.g., using a fan) or radiation
Implementation Method 3
Heat transferred to the radiator from the chip may be dissipated by convection (e.g., using a fan) or radiation
Data Source
Figure 1~2C
Figure 3
AI summary
A chip cooling system 10 including a semiconductor device 12 having a bulk region 14, wherein at least one fluid channel 16 extends at least partially through the bulk region 14, the fluid channel 16 having an inlet 18 and an outlet 20, a fluid inlet port 36 in fluid communication with the channel inlet 18, and a fluid outlet port 38 in fluid communication with the channel outlet 20, and a cooling fluid flows from the fluid inlet port 36, through the fluid channel 16 and to the fluid outlet port 38 to cool the bulk region 14.