Semiconductor Chip Diagonal Alignment for Thermal Uniformity
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Solution Overview
Problem
Existing semiconductor devices with V-shaped chip alignments suffer from temperature non-uniformity and challenging chip mounting processes due to the use of metal blocks with V-shaped grooves.
Innovation Solution
A semiconductor device design featuring a base member with a wall portion and two semiconductor chips aligned diagonally with respect to each other, allowing for uniform temperature distribution and simplified manufacturing, where one chip is mounted on an inclined surface of a base member with a bottom surface, facilitating easier assembly and size reduction.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If semiconductor chips are aligned in a V-shape in a planar view, then the device size is reduced, but temperature uniformity deteriorates
Solution Approach 1:
The patent applies asymmetry by changing the chip arrangement from a symmetric V-shape to an asymmetric diagonal alignment where chips are positioned at 45 degrees to the inner wall surfaces. This asymmetric positioning ensures that all chips are equidistant from the heat source while maintaining compact device size, thereby achieving both size reduction and temperature uniformity.
2Ease of manufacture
If a metal block with a V-shaped groove portion is used, then chip mounting is achieved, but the work of mounting becomes difficult
Solution Approach 1:
The patent inverts the conventional approach by providing inclined surfaces on the base member instead of creating V-shaped grooves in a metal block. This inversion simplifies the mounting process as chips can be directly placed on the inclined surfaces without requiring complex groove formation, thereby improving ease of manufacture while reducing device complexity.
Data Source
AI summary
A semiconductor device is provided with a base member having a front surface and a plurality of semiconductor chips provided on the front surface and each having a long side and a short side, the plurality of semiconductor chips being aligned so that the long sides are faced with each other. The plurality of semiconductor chips are provided diagonally, respectively, so that the adjacent semiconductor chips are inclined to the same side in a planar view of the front surface.