Semiconductor Chip Dynamic ID Allocation for Stack Package Failure Recovery

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Solution Overview

Problem

Conventional semiconductor integrated circuits with stack package structures cannot utilize remaining chips when one fails due to fixedly allocated chip ID codes, limiting their functionality and yield.

Innovation Solution

Incorporating an ID selection control unit to generate an ID selection signal for selecting between unique and alternative ID codes, and a chip ID code generation unit to generate chip ID codes based on this signal, allowing for dynamic ID selection and alternative ID allocation when a chip fails, enabling continued operation of the semiconductor system.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If chip ID codes are fixedly allocated to each semiconductor chip in a stack package, then the chip selection and identification function is simplified, but the system cannot utilize remaining chips when one fails, reducing reliability and yield

Engineering Contradiction:
Improvesystem functionality when chip failsVSAvoidID allocation and selection mechanism
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

The patent implements dynamic ID code allocation where chip ID codes are not fixed but can be changed based on operational conditions. When a chip fails, the system dynamically reassigns ID codes to remaining functional chips, allowing the stack package to continue operation. This is achieved through control logic that detects chip failures and redistributes ID codes accordingly, transforming the static ID allocation system into a dynamic one that adapts to runtime conditions.

Inventive Principle:
Principle #15Dynamics

Solution Approach 2:

The patent changes the parameter of chip ID code assignment from fixed to variable. By introducing the ability to modify ID codes based on chip operational status, the system can reassign identifiers when failures occur. This parameter change enables the same physical chip to assume different logical identities depending on which other chips are functional, thereby maintaining system reliability without requiring additional hardware complexity.

Inventive Principle:
Principle #35Parameter changes

2Productivity

If each semiconductor chip has unique ID allocation capability, then chip identification is precise, but when one chip fails all chips cannot be utilized, reducing productivity

Engineering Contradiction:
Improveutilization of remaining chipsVSAvoidID management system
Core Design Contradiction:
ProductivityVSDevice complexity

Solution Approach 1:

The patent makes the ID code assignment system universal by enabling any functional chip to assume any chip's ID code. Instead of each chip being locked to a specific ID, the system allows functional chips to take on alternative identities. This multi-functionality enables the ID management system to serve both normal operation (where each chip has its designated ID) and failure recovery modes (where functional chips can assume IDs of failed chips), thereby maximizing productivity without significantly increasing complexity.

Inventive Principle:
Principle #6Universality (Multi-functionality)

Solution Approach 2:

The patent implements a form of copying where the ID code of a failed chip is copied and assigned to a functional chip. Rather than creating entirely new identification schemes, the system replicates the ID codes of non-functional chips onto available chips, allowing the system to maintain the appearance of having all original chips functional. This copying approach enables continued operation with existing chips while avoiding the need for complex new identification protocols.

Inventive Principle:
Principle #26Copying

Data Source

PatentUS9177625B2Semiconductor chip, semiconductor integrated circuit including the semiconductor chip, semiconductor system including the semiconductor integrated circuit and method of driving the semiconductor system
Publication Date: 2015.11.03 SK HYNIX INC
  • US9177625B2 patent drawing
  • US9177625B2 patent drawing
  • US9177625B2 patent drawing

AI summary

A semiconductor system including a semiconductor integrated circuit or a semiconductor chip, and a method of driving the semiconductor system are described. The semiconductor integrated circuit includes a plurality of semiconductor chips, at least one first chip through via suitable for penetrating through the plurality of semiconductor chips and interfacing a source ID code between the plurality of semiconductor chips, a plurality of second chip through vias suitable for penetrating through the plurality of semiconductor chips and interfacing a plurality of chip selection signals between the plurality of semiconductor chips, wherein the semiconductor chip uses one of chip selection signals as an internal chip selection signal in response to a chip ID code by selecting one of a unique ID code for the semiconductor chip and an alternative ID code for a preset semiconductor chip when the semiconductor chip fails.