Semiconductor Chip Frame Structure for Resin Potting
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Solution Overview
Problem
The existing method of resin potting for semiconductor chips is inadequate as the chip coating material spreads or collapses before curing, exposing parts of the semiconductor chip and failing to provide full protection, which reduces the durability of the semiconductor device.
Innovation Solution
A semiconductor device design featuring a chip container with a frame part surrounding the semiconductor chip, where the chip coating material is contained within the frame, ensuring complete coverage and protection by defining the region injected with the material, thereby preventing exposure and enhancing durability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the semiconductor chip is subjected to potting with chip coating material, then the chip coating material covers the semiconductor chip, but the chip coating material may spread or collapse before curing, causing parts of the semiconductor chip to be exposed and reducing protection
Solution Approach 1:
The invention introduces a frame structure that divides the chip container into a defined interior space, segmenting the chip coating material containment area. This segmentation prevents the chip coating material from spreading beyond the frame's interior space, ensuring uniform coverage and preventing exposure of semiconductor chip parts.
Solution Approach 2:
The frame acts as an intermediary structure between the chip coating material and the chip container wall. It provides a physical barrier that mediates the interaction between the liquid chip coating material and the container, controlling the material's spread and maintaining coverage precision during the curing process.
2Reliability
If the chip coating material is potted without a frame structure, then the manufacturing process is simpler, but the chip coating material cannot fully protect the semiconductor chip due to spreading or collapsing
Solution Approach 1:
By segmenting the chip container with a frame structure, the invention creates a defined interior space that confines the chip coating material. This segmentation adds structural complexity but ensures complete coverage and protection of the semiconductor chip, improving device durability.
Solution Approach 2:
The frame structure is pre-installed in the chip container before potting the chip coating material. This preliminary action defines the containment space in advance, preventing spreading or collapsing issues during the potting process and ensuring complete chip coverage without requiring complex post-processing.
3Manufacturing precision
If a frame structure is added to define the chip coating material region, then complete coverage of the semiconductor chip is ensured, but the device complexity increases
Solution Approach 1:
The frame structure segments the chip container into a defined interior space, providing precise boundaries for chip coating material placement. This segmentation achieves high coverage precision by preventing material spread beyond the frame, while the frame's simple geometric design minimizes the increase in overall device complexity.
Solution Approach 2:
The frame serves as an intermediary element that simplifies the potting process by providing clear boundaries for material placement. While it adds a structural component, it actually reduces the need for complex control mechanisms during potting, as the frame physically guides the material containment.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design ensures reliable coverage of the semiconductor chip with the chip coating material, improving the durability of the semiconductor device by preventing exposure and moisture infiltration, while simplifying the manufacturing process and reducing manufacturing costs.
Implementation Method 1
the form of the potted resin depends on the surface tension of the chip coating material until the chip coating material cures
Data Source
AI summary
The semiconductor device in accordance with one mode comprises a semiconductor chip; a chip mounting substrate on which the semiconductor chip is mounted; a chip container that is provided on the chip mounting substrate and contains the semiconductor chip; and a seal part that seals the chip container containing the semiconductor chip and the chip mounting substrate. The chip container has a frame part surrounding a periphery of the semiconductor chip. The height of the frame part is greater than that of the semiconductor chip. The inside of the frame part in the chip container is provided with a chip coating material that protects the semiconductor chip.