Semiconductor Chip Heat-Radiating Plug Thermal Management
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Solution Overview
Problem
Conventional semiconductor chips face challenges in efficiently radiating heat, leading to increased temperature and erroneous operations due to the inability to dissipate heat effectively from the reverse surface, which affects the reliability and performance of semiconductor devices.
Innovation Solution
Incorporating a heat-radiating plug made of a material with higher thermal conductivity than the substrate, formed in a non-penetrating hole on the reverse surface, allowing for efficient heat transmission and radiation from semiconductor elements to the reverse surface of the substrate, connected to a heat-radiating portion of a circuit board.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If a plurality of semiconductor elements passing large currents are formed to increase performance, then the processing capability is improved, but the temperature of the semiconductor chip increases due to large amounts of heat generated
Solution Approach 1:
The heat radiation function is segmented from the substrate and assigned to dedicated heat-radiating plugs positioned beneath specific high-heat-generating elements. This allows localized heat management without affecting the entire chip, enabling higher processing capability while controlling temperature through distributed thermal management structures.
Solution Approach 2:
Heat-radiating plugs serve as intermediary structures between the semiconductor elements and the external environment. These plugs, made of high thermal conductivity material, mediate the heat transfer from the element through the substrate to the heat-radiating portion on the circuit board, enabling efficient heat dissipation while maintaining element performance.
2Device complexity
If heat is radiated only via the semiconductor substrate, then the structure is simple, but heat radiation efficiency is insufficient leading to deteriorated operation reliability
Solution Approach 1:
Rather than uniformly modifying the entire substrate, the invention applies local quality enhancement by inserting heat-radiating plugs only in specific regions beneath high-heat-generating elements. This localized approach improves heat radiation efficiency and reliability where needed while maintaining overall structural simplicity and minimizing added complexity.
3Area of stationary object
If the interval between semiconductor elements is reduced to reduce chip area, then the chip size is reduced, but heat dissipation becomes more difficult due to closer spacing
Solution Approach 1:
The invention addresses heat dissipation in the vertical dimension by extending heat-radiating plugs from the element interface through the substrate to the rear surface. This three-dimensional heat conduction path allows efficient heat removal even when elements are closely spaced in the horizontal plane, enabling reduced chip area without compromising heat dissipation capability.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution effectively suppresses temperature increases, improves the reliability of semiconductor chips, and allows for a reduction in chip size by enabling efficient heat dissipation without affecting the operation of integrated circuits.
Implementation Method 1
The heat-radiating plug is made of a material having a thermal conductivity greater than that of the substrate formed in a non-penetrating hole having its opening on a reverse surface
Implementation Method 2
By connecting the heat-radiating plug to a heat-radiating portion of a circuit board, it is possible to efficiently radiate heat and to thereby suppress the temperature increase of the semiconductor chip
Data Source
AI summary
A semiconductor chip, including: a substrate including an front surface; an integrated circuit formed on the front surface and including a plurality of semiconductor elements; and a heat-radiating plug formed in a region of the substrate corresponding to at least one of the semiconductor elements. The heat-radiating plug is made of a material having a thermal conductivity greater than that of the substrate formed in a non-penetrating hole having its opening on a reverse surface of the substrate.