Semiconductor Chip Heat Transfer Device with Liquid Chamber
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing heat transfer devices face challenges in efficiently mitigating thermal resistance between semiconductor chips and larger heat sinking devices, necessitating improved heat transfer methods to manage increasing power and power density.
Innovation Solution
A self-contained liquid chamber with embedded heat pipes and a rotating blade mechanism to circulate liquid coolant, ensuring better heat transfer and incorporating leak detection and expansion accommodation features.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a liquid cooling chamber is used to improve heat transfer from semiconductor chips, then heat dissipation efficiency is improved, but the risk of liquid leakage increases
Solution Approach 1:
The patent uses a flexible bellows structure made of elastic material to replace rigid sealing mechanisms. The bellows can expand and contract to accommodate thermal expansion and pressure changes while maintaining the seal integrity of the liquid cooling chamber, thus preventing leakage while enabling effective heat transfer.
Solution Approach 2:
The patent incorporates a leak detection mechanism that uses a sensor to detect liquid leakage before it causes serious damage. The system provides early warning and can trigger protective actions, cushioning against the harmful effects of potential leakage while maintaining the liquid cooling system's heat dissipation effectiveness.
2Temperature
If heat pipes are embedded in the liquid chamber to improve heat transfer, then thermal resistance is reduced, but device complexity increases
Solution Approach 1:
The patent combines multiple heat transfer functions into a single integrated liquid cooling chamber structure. The chamber incorporates both direct liquid cooling channels and embedded heat pipes, merging convection and phase-change heat transfer mechanisms into one unified system, thereby reducing thermal resistance without proportionally increasing complexity.
Solution Approach 2:
The liquid cooling chamber serves multiple functions simultaneously: it acts as a containment vessel for the coolant, provides thermal conduction paths through embedded heat pipes, offers structural support for mounting semiconductor chips, and includes integrated leak detection and expansion accommodation features. This multi-functionality reduces the need for separate components.
3Temperature
If rotating blades are used to circulate liquid coolant to improve heat transfer, then heat dissipation is enhanced, but device complexity and potential failure points increase
Solution Approach 1:
The patent incorporates a rotation speed control mechanism that uses feedback from temperature sensors to adjust the rotating blades' speed. The system monitors the thermal conditions and automatically optimizes the coolant circulation rate, enhancing heat transfer efficiency while avoiding unnecessary mechanical complexity from overly sophisticated control systems.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enhances heat dissipation efficiency by ensuring reliable, leak-proof operation and effective heat transfer from semiconductor chips to heat sinks, with integrated monitoring and protection mechanisms.
Implementation Method 1
The other end of the heat pipes is protruded outside of the chamber and attached to heat sinks
Implementation Method 2
heat transfer from the hot side of the chamber which has microchannels embedded, to the heat pipes
Implementation Method 3
The liquid inside the chamber is propelled to circulate within the chamber by rotating blades driven by an electric motor. The circulating liquid will carry heat from the hot side of the chamber
Implementation Method 4
The other end of the heat pipes is protruded outside of the chamber and attached to heat sinks
Data Source
AI summary
A method and apparatus for improving the heat transfer from a semiconductor chip to its heat sinking device. The heat transfer device has a liquid chamber in which liquid is circulated within the chamber to spread the heat from one location of the chamber to the heat pipes partially mounted in the chamber. The heat is then carried away by the heat pipes to a remote heat sinking device. The chamber has built-in mechanism to allow the liquid to expand during normal operation and its expansion status to be monitored.