Reusable Semiconductor Chip Holder with Plug-secured Cover
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Solution Overview
Problem
Current tape and reel packaging methods for semiconductor chips are inefficient due to adhesive cover tapes causing chips to stick and become damaged, leading to material waste and high costs, as they are typically used once and discarded.
Innovation Solution
A semiconductor chip holder with a flexible support substrate and non-adhesive cover layer, secured by plugs, that holds chips in receptacles without adhesives, allowing for reusable and cost-effective packaging.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Stability of the object's composition
If adhesive cover tapes are used to secure chips in tape and reel packaging, then chips are held in place during transport, but chips stick to the adhesive and become damaged
Solution Approach 1:
The patent removes the adhesive layer from the cover tape, extracting the harmful adhesive property while retaining the structural function of the cover tape to protect and secure chips during transport
Solution Approach 2:
The patent introduces a recessed cavity structure as an intermediary between the chip and the cover tape, allowing the chip to be held securely in place through mechanical confinement rather than adhesive bonding
2Stability of the object's composition
If adhesive cover tapes are used to secure chips, then chips are fixed during transport, but the packaging becomes disposable and cannot be reused
Solution Approach 1:
The adhesive layer is completely removed from the cover tape, transforming it from a single-use disposable component to a reusable protective element that can be removed and reapplied multiple times without degradation
Solution Approach 2:
The patent enables recovery and reuse of the cover tape by eliminating the adhesive layer that previously caused permanent bonding and degradation, allowing the same packaging to be used repeatedly for multiple chips
3Stability of the object's composition
If adhesive layers are used in cover tapes, then chips are secured, but material waste increases due to single-use disposal
Solution Approach 1:
The adhesive layer is extracted from the cover tape structure, eliminating the material that previously caused waste through single-use disposal while maintaining chip securing functionality through mechanical means
Solution Approach 2:
The reusable cover tape design allows continuous use of the same packaging material for multiple chips, recovering the material that would otherwise be discarded after a single use and reducing overall material consumption
4Stability of the object's composition
If adhesive cover tapes are used, then chips are held securely, but the packaging thickness increases
Solution Approach 1:
The packaging structure is segmented into distinct functional layers: a thin protective cover tape without adhesive, and recessed cavities that provide the securing function, allowing each component to be optimized for minimal thickness while maintaining effectiveness
Data Source
AI summary
The various embodiments provide a semiconductor chip holder that holds semiconductor chips. The chip holder protects the semiconductor chips from possible damage during transport and/or storage. The chip holder is flexible and may be wound around a reel for convenient transport and storage. In one embodiment, the chip holder includes a support substrate with receptacles that receive semiconductor chips, a cover layer that seals the receptacles and holds the semiconductor chips within the receptacles, and plugs to securely couple the support substrate and the cover layer together.