Semiconductor Chip Layout for Simultaneous IGBT Switching
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Solution Overview
Problem
Existing power semiconductor devices face issues with non-simultaneous switching and unbalanced current distribution among IGBT chips due to shared current paths, leading to performance imbalances and potential chip failure, especially as device size and current rating increase.
Innovation Solution
A semiconductor device design featuring a circuit board with aligned contact pads and conductive spacers that decouple the driver circuit from the power circuit, allowing for balanced impedance connections between the circuit board and semiconductor chips without additional components, thereby ensuring simultaneous switching and maintaining thermal performance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If a shared current path is used to connect the driver circuit and power circuit to the semiconductor chips, then the device complexity is reduced, but the switching simultaneity and current distribution balance deteriorate
Solution Approach 1:
The patent divides the common current path into separate driver circuit path and power circuit path. The driver circuit connects to the control electrode through a dedicated path, while the power circuit connects to the first and second electrodes through a separate path. This segmentation eliminates the shared current path, ensuring that switching signals are not affected by power current fluctuations, thereby achieving simultaneous switching and balanced current distribution across all semiconductor chips.
Solution Approach 2:
The patent introduces an intermediate connection structure where the driver circuit and power circuit are coupled to the semiconductor chips through distinct electrical paths. The driver circuit path includes connections to the control electrode, while the power circuit path includes connections to the first and second electrodes. This intermediary structure acts as a mediator that prevents direct interaction between driver and power currents, resolving the contradiction between simplicity and reliability.
2Reliability
If additional components are added to decouple the driver circuit from the power circuit, then the switching simultaneity improves, but the device complexity and component count increase
Solution Approach 1:
The patent merges the decoupling function into the existing circuit board layout and electrical connection structure. Rather than adding separate decoupling components, the design integrates distinct electrical paths for the driver circuit and power circuit within the same device housing. The driver circuit path and power circuit path are separated through strategic routing and connection points, achieving decoupling without requiring additional external components.
Solution Approach 2:
The circuit board and electrical connections serve multiple functions: they provide mechanical support, establish electrical connections, and simultaneously decouple the driver circuit from the power circuit through their routing design. The same physical structure that connects the chips also provides the circuit separation, eliminating the need for dedicated decoupling components and reducing overall device complexity.
3Ease of manufacture
If the driver circuit and power circuit share a common current path, then the manufacturing process is simplified, but the thermal performance and reliability deteriorate
Solution Approach 1:
The patent applies different connection qualities to different parts of the circuit. The driver circuit path is designed with low inductance and optimized for high-frequency switching signals, while the power circuit path is designed with high current carrying capacity and optimized for power transmission. This local optimization of connection characteristics ensures that each circuit path is tailored to its specific functional requirements, improving both thermal performance and reliability without complicating the overall manufacturing process.
Data Source
AI summary
A semiconductor device comprising: a plurality of semiconductor chips; a first conductor and a second conductor arranged at opposite sides of the semiconductor chips, wherein the second conductor comprises a plurality of pillars, and wherein each of the semiconductor chips comprises: a first surface facing the first conductor; a first electrode arranged on the first surface and electrically coupled to the first conductor; a second surface opposite to the first surface; a second electrode arranged on the second surface and electrically coupled to a respective one of the pillars, and a control electrode arranged on the second surface and configured to switch a current flowing between the first electrode and the second electrode; a circuit board comprising openings penetrated by the plurality of pillars, wherein the circuit board further comprises an electrically insulating layer, a first conductive film and a second conductive film.