Semiconductor Chip Temperature Sensing via Impedance Elements
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Solution Overview
Problem
Traditional temperature compensation methods for semiconductor apparatuses fail to accurately measure and compensate for the temperature of each semiconductor chip during device operation, leading to inaccuracies, especially in high-temperature ranges due to fluctuations in in-plane wafer temperatures.
Innovation Solution
A semiconductor apparatus with pad electrodes and an impedance element, such as a resistance element, connected between them, allowing for temperature measurement and compensation by applying electrical signals from outside the chip, enabling accurate temperature sensing and compensation for each semiconductor chip.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If traditional thermocouple contact method is used to measure wafer temperature, then temperature measurement is possible, but measurement precision deteriorates due to in-plane temperature fluctuations and fails to recognize actual temperature for each semiconductor chip during device driving
Solution Approach 1:
The invention divides the temperature measurement function into individual semiconductor chip level by integrating impedance elements directly on each chip. Instead of measuring the entire wafer as one unit, each chip has its own temperature sensing capability through the impedance element, allowing independent temperature measurement that accounts for local temperature variations across the wafer surface.
Solution Approach 2:
The invention replaces the mechanical contact method (thermocouple physical contact with pad electrode) with an electrical field-based measurement method. By applying an AC electrical signal to the impedance element on the semiconductor chip, temperature is measured through electrical impedance changes rather than mechanical thermocouple contact, eliminating the limitations of the traditional method.
2Device complexity
If temperature sensor inside device is used, then temperature measurement is integrated, but manufacturing variation causes fluctuations in temperature measurements that require complex compensation
Solution Approach 1:
The invention introduces an impedance element as an intermediary for temperature measurement. This impedance element, formed by metal patterns on the semiconductor chip, serves as a mediator between the temperature field and the measurement system. The impedance element's electrical properties change with temperature, providing a reliable temperature indicator that is less susceptible to manufacturing variations compared to traditional temperature sensors.
3Ease of manufacture
If traditional temperature compensation method is used, then compensation process is established, but fails to achieve accurate temperature recognition for each semiconductor chip due to in-plane wafer temperature fluctuations
Solution Approach 1:
The invention implements local temperature measurement by placing impedance elements directly on each semiconductor chip. This allows each chip to have its own localized temperature measurement capability, accounting for the fact that temperature varies across different locations on the wafer. Each chip's impedance element reflects the local temperature conditions at that specific chip location rather than an average wafer temperature.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution allows for precise temperature measurement and compensation for each semiconductor chip, improving accuracy to ±1 degree in high-temperature ranges and enabling reliable operation by addressing the limitations of traditional methods.
Implementation Method 1
an impedance element electrically connected between at least two pad electrodes of the plurality of pad electrodes, wherein the semiconductor apparatus is capable of measuring a temperature of the semiconductor chip by applying a certain electrical signal between the at least two pad electrodes connected with the impedance element from outside of the semiconductor chip
Data Source
AI summary
An object of the present invention is to provide a semiconductor apparatus capable of recognizing the actual temperature for each semiconductor chip even while driving the device.A semiconductor apparatus of the present disclosure includes a semiconductor chip, a plurality of pad electrodes formed in the semiconductor chip, and an impedance element electrically connected between at least two pad electrodes of the plurality of pad electrodes. Then, the semiconductor apparatus is configured to be capable of measuring a temperature of the semiconductor chip by applying a certain electrical signal between the at least two pad electrodes connected with the impedance element from outside of the semiconductor chip.