Semiconductor Device Parallel Chip Measurement
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Solution Overview
Problem
Existing semiconductor devices with IGBT and MOSFET chips connected in parallel face challenges in measuring individual chip characteristics due to synthesized characteristics, making it difficult to assess factory-default withstand voltage and leakage current, and complicating downsizing efforts.
Innovation Solution
A semiconductor device design featuring first and second semiconductor chips on a metal plate with electrode terminals that include contact parts forming a connection area for external connection, allowing for individual measurement of electrical characteristics without complex wiring.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If external connection terminals are used to measure individual chip characteristics, then measurement capability is improved, but device complexity increases
Solution Approach 1:
The patent merges the functions of multiple external connection terminals into a single integrated terminal structure. The terminal includes a terminal body with multiple contact parts that can simultaneously connect to multiple main electrodes, eliminating the need for separate external terminals for each measurement and reducing overall connection complexity while maintaining individual chip measurement capability
Solution Approach 2:
The external connection terminal is designed with multi-functionality to serve multiple purposes: it can measure characteristics of different semiconductor chips (IGBT, MOSFET, diode) through its multiple contact parts, and can also serve as a common connection point for various electrical measurements. This universal design reduces the number of specialized terminals needed
2Measurement precision
If multiple external connection terminals are provided for each semiconductor chip, then individual measurement capability is improved, but the connection area becomes larger
Solution Approach 1:
The patent implements a nested structure where multiple contact parts are integrated within a single terminal body. The terminal body contains multiple contact parts that can simultaneously engage with multiple main electrodes, effectively nesting multiple connection functions within a compact structure that minimizes the overall connection area while enabling individual chip measurements
3Measurement precision
If separate external connection terminals are used for collector and drain terminals, then measurement accuracy is improved, but downsizing becomes difficult
Solution Approach 1:
The patent transitions from a planar arrangement of separate external terminals to a three-dimensional integrated terminal structure. The terminal body extends in multiple dimensions with contact parts positioned at different heights and locations, allowing multiple electrical connections to be achieved within a compact footprint that enables device downsizing while maintaining measurement precision
Data Source
AI summary
A semiconductor device includes first and second contact parts that are disposed close to each other with an interval therebetween and form a screw hole (connection area) to which an external connection terminal is connected. The first contact part extends from a side of a case via a first linkage part that extends from the side, and the second contact part extends from the side via a second linkage part that extends from the side. The first and second linkage parts are disposed away from each other by at least a certain interval. In this way, the semiconductor device is allowed to have first and second semiconductor chips connected in parallel with each other and function as a semiconductor device. In addition, electrical characteristics of the first and second semiconductor chips of the semiconductor device are individually measured.