Semiconductor Chip Joining Member With Positive Temperature Coefficient Resistivity
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Solution Overview
Problem
Conventional semiconductor devices face issues with rapid temperature increase and potential breakdown due to short-circuits between heat radiation members, leading to low responsiveness in temperature control and potential damage to the semiconductor chip.
Innovation Solution
Incorporating a joining member with a protective material that has a positive temperature coefficient of resistivity, which increases steeply above a threshold temperature, to reduce current flow and prevent the semiconductor chip from reaching breakdown temperatures, while also using a base material with lower resistivity to minimize conduction loss at lower temperatures.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If heat radiation members are used to dissipate heat from the semiconductor chip, then heat dissipation is improved, but short-circuits between heat radiation members can cause rapid temperature increase and chip breakdown
Solution Approach 1:
A joining member is introduced as an intermediary component between the semiconductor chip and heat radiation members. This joining member includes a protective material that prevents short-circuits between heat radiation members while maintaining thermal conduction, thus resolving the contradiction between heat dissipation and reliability
Solution Approach 2:
The protective material in the joining member automatically responds to temperature increases by utilizing its positive temperature coefficient characteristics. When short-circuits occur and temperature rises, the protective material's resistivity increases, automatically reducing current flow and preventing further temperature increase without external control
2Reliability
If conventional joining members are used to connect heat radiation members, then electrical connection is achieved, but responsiveness in temperature control is low when short-circuits occur
Solution Approach 1:
The protective material automatically responds to temperature increases through its positive temperature coefficient characteristics, eliminating the need for external detection and control systems. This self-responsive mechanism achieves rapid temperature control without time loss
Solution Approach 2:
The protective material's resistivity parameter changes in response to temperature changes. When temperature increases due to short-circuits, the resistivity increases, automatically reducing current flow and providing rapid response to temperature control without external intervention
3Reliability
If protective material with positive temperature coefficient is used in joining member, then temperature control responsiveness is improved, but conduction loss increases at lower temperatures
Solution Approach 1:
The joining member is constructed as a composite material combining a base material with low resistivity and a protective material with positive temperature coefficient. The base material minimizes conduction loss at normal operating temperatures, while the protective material provides temperature control responsiveness when temperatures rise
Solution Approach 2:
Different regions of the joining member have different material properties optimized for different functions. The base material provides low-resistivity conduction for normal operation, while the protective material provides temperature-responsive characteristics for fault protection, with each material's properties optimized for its specific role
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration effectively suppresses temperature increases, improves durability, and maintains responsiveness by automatically reducing current flow when temperatures rise, thereby preventing chip breakdown and reducing conduction loss.
Implementation Method 1
a protective material that has a positive temperature coefficient of resistivity, and the positive temperature coefficient of resistivity is larger in a temperature range that is higher than a threshold temperature than in a temperature range that is lower than the threshold temperature
Implementation Method 2
a joining member that is electrically connected to an electrode portion of a semiconductor chip to allow an electric current to flow in the semiconductor chip through the joining member
Implementation Method 3
The first heat radiation member and the second heat radiation member are thermally and electrically connected to the semiconductor chip, respectively, through the joining members. The first heat radiation member and the second heat radiation member serve to dissipate heat generated from the semiconductor chip
Data Source
AI summary
A semiconductor device includes a semiconductor chip having an electrode portion and a joining member electrically connected to the electrode portion to allow an electric current to flow in the semiconductor chip through the joining member. The joining member contains a protective material that has a positive temperature coefficient of resistivity, and the positive temperature coefficient of resistivity has a larger value in a temperature range higher than a threshold temperature than in a temperature range lower than the threshold temperature, the threshold temperature being a predetermined temperature lower than a breakdown temperature of the semiconductor chip. The electrode portion of the semiconductor chip may contain the protective material.