Semiconductor Chip Lamination Using Adhesive Foil and Diffusion Solder
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Solution Overview
Problem
Current semiconductor device packaging methods are costly and inefficient, particularly in terms of yield and expense, due to the complexity of protecting and electrically coupling semiconductor chips to carriers while maintaining high performance.
Innovation Solution
The use of an adhesive foil with uncured resin materials like epoxy or polyimide to laminate semiconductor chips onto a multi-device carrier, forming an encapsulant that also serves as a transfer foil, combined with diffusion solder or sintered metal particles for bonding, allowing for thin, temperature-resistant connections and efficient encapsulation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional packaging methods are used to protect and electrically couple semiconductor chips, then reliability is improved, but manufacturing cost increases and productivity decreases
Solution Approach 1:
The patent combines multiple packaging functions into a single integrated carrier structure that simultaneously provides mechanical support, electrical coupling, and protection for semiconductor chips, eliminating the need for separate packaging components and processes
Solution Approach 2:
The carrier structure is designed to perform multiple functions: it serves as a mechanical support base, an electrical interconnection substrate, and a protective enclosure for the chips, thereby simplifying the overall packaging system while maintaining reliability
2Reliability
If conventional packaging methods are used to protect and electrically couple semiconductor chips, then reliability is improved, but manufacturing cost increases
Solution Approach 1:
The patent merges multiple packaging components into a single integrated carrier, reducing the number of assembly steps and materials required, which directly lowers manufacturing costs while maintaining protective and electrical coupling functions
Solution Approach 2:
The invention changes the physical and electrical parameters of the carrier structure to enable simultaneous achievement of mechanical support, electrical interconnection, and environmental protection functions at lower manufacturing cost
3Ease of manufacture
If thick bond layers are used for electrical coupling, then ease of manufacture is improved, but temperature resistance during heating processes worsens
Solution Approach 1:
The patent optimizes the thickness parameter of the bond layer to a specific range that simultaneously provides adequate electrical conductivity for easy manufacturing and sufficient thermal stability to withstand solder reflow and other heating processes without degradation
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method reduces packaging costs and increases yield by enabling thin, reliable bond layers that withstand heating processes, such as solder reflow, while providing effective mechanical and electrical connections to the carrier.
Implementation Method 1
The use of an adhesive foil with uncured resin materials like epoxy or polyimide to laminate semiconductor chips onto a multi-device carrier, forming an encapsulant
Implementation Method 2
adhesive foil with uncured resin materials like epoxy or polyimide to laminate semiconductor chips onto a multi-device carrier
Implementation Method 3
diffusion solder or sintered metal particles for bonding, allowing for thin, temperature-resistant connections
Implementation Method 4
sintered metal particles for bonding, allowing for thin, temperature-resistant connections
Data Source
AI summary
A method of manufacturing a semiconductor device includes providing a transfer foil. A plurality of semiconductor chips is placed on and adhered to the transfer foil. The plurality of semiconductor chips adhered to the transfer foil is placed over a multi-device carrier. Heat is applied to laminate the transfer foil over the multi-device carrier, thereby accommodating the plurality of semiconductor chips between the laminated transfer foil and the multi-device carrier.