Lifting Device for Semiconductor Chip Removal from Adhesive Film
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Thin chip-shaped semiconductor components are prone to damage during removal from adhesive films due to their fragility, especially when processed in pic-and-place systems.
Innovation Solution
A device with a lifting mechanism featuring pin-shaped or spherical ends that deform the film to reduce adhesive forces, combined with controlled negative pressure and optional thermal management to facilitate safe removal, ensuring the semiconductor components are lifted without damage.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional pressing devices are used to remove thin semiconductor components from adhesive films, then the removal process can be performed, but the risk of damage to the semiconductor components significantly increases
Solution Approach 1:
The patent introduces a lifting device with suction recesses as an intermediary between the pressing device and the semiconductor component. This lifting device creates a lifting force through negative pressure that acts on the adhesive film rather than directly on the fragile semiconductor component, thereby enabling removal while minimizing damage risk
Solution Approach 2:
The patent replaces direct mechanical contact with the semiconductor component (conventional pressing) with a pneumatic system (suction device creating negative pressure). This substitution allows the adhesive film to be lifted and released without applying concentrated mechanical stress to the thin semiconductor component
2Productivity
If the semiconductor components are made thinner to reduce size, then the integration density increases, but the fragility and risk of breakage during removal increases
Solution Approach 1:
The lifting device with suction recesses serves as a mediator that interacts with the adhesive film rather than the fragile semiconductor component. The negative pressure lifts the film with the component still attached, allowing thin components to be removed without direct mechanical contact that would cause breakage
Solution Approach 2:
The patent changes the pressure parameter by applying negative pressure through the suction device. This creates a lifting force that overcomes the adhesive forces without requiring direct mechanical contact, enabling safe handling of thinner, more fragile semiconductor components
3Ease of operation
If pressing force is applied directly to the semiconductor component for removal, then the removal process is simple, but the adhesive forces cause damage to the thin components
Solution Approach 1:
The lifting device with suction recesses acts as an intermediary that applies negative pressure to the adhesive film. This creates a lifting force that reduces adhesive bonding without requiring direct pressing on the semiconductor component, thereby maintaining component integrity during removal
Solution Approach 2:
Instead of applying downward pressing force directly on the semiconductor component to break adhesion, the patent inverts the approach by applying upward lifting force through negative pressure on the adhesive film. This reverse approach achieves removal while protecting the component from damage
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution significantly reduces the risk of damage to semiconductor components by minimizing adhesive forces and allowing for controlled removal, ensuring effective handling in pic-and-place systems.
Implementation Method 1
a suction device (50, 52) with a plurality of suction recesses (50, 52), which are connected to associated vacuum sources (60, 62), for holding the at least one semiconductor component (10)
Implementation Method 2
The pin-shaped lifting means have a pointed or spherical end, which can pass through the associated recesses and protrude beyond the plane of the contact area, thereby deforming the film
Implementation Method 3
the lifting device has a thermal device for changing the temperature of the adhesive film. Depending on the application, for example depending on the film used, it can make sense to lower or raise the temperature
Implementation Method 4
Increasing the temperature is an example of how to increase the elasticity of the film
Data Source
Figure 1
Figure 2
Figure 3~4
AI summary
The application relates to a device and a method for operating this device for removing at least one chip-shaped semiconductor component from an adhesive film, comprising the steps of: arranging the lifting device against the film, wherein a contact area of the lifting device rests against a second main surface of the film opposite a chip-shaped semiconductor component to be lifted, which is arranged on a first main surface. Applying a vacuum to a plurality of suction recesses of the lifting device by means of an associated vacuum control device with a constant vacuum value for all suction recesses or with different vacuum values for different suction recesses or groups of suction recesses. Partially deforming the film in the contact area by lifting the film by means of lifting means arranged in associated recesses of the lifting device.Removing at least one semiconductor component from the film using a removal device.