Semiconductor Chip Package Asymmetric Connectors Orientation

Solution Overview

Problem

Semiconductor chip packages are prone to malfunction and internal circuit damage due to incorrect mounting orientations, as existing technologies rely on specific conventions and indicators that can be mistakenly ignored by operators.

Innovation Solution

A semiconductor chip package design featuring an insulating substrate with symmetrically disposed connectors and a radiating pad, connected by bonding wires, which allows the chip to function regardless of mounting orientation, ensuring that equivalent internal circuits remain connected and operational even when rotated.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Measurement precision

If specific indicators such as a first connecting lead are provided to ensure correct positioning, then positioning accuracy is improved, but operator mistakes can still occur causing malfunction and internal circuit damage

Engineering Contradiction:

Improvepositioning accuracyVSAvoidfunctional reliability

Core Design Contradiction:

Measurement precisionVSReliability

Solution Approach 1:

The patent applies asymmetry by providing asymmetric connector arrangements on opposite sides of the insulating substrate. Specifically, the first connector has a different configuration from the second connector, creating an asymmetric overall structure that prevents incorrect mounting orientations. This resolves the contradiction by making the device inherently orientation-sensitive at the structural level, thereby improving reliability without relying solely on operator attention to indicators.

Inventive Principle:

Principle #4Asymmetry

Solution Approach 2:

The patent inverts the conventional approach by making the connector configurations themselves asymmetric rather than relying on separate indicators. Instead of adding indicators to an otherwise symmetric structure, the invention makes the functional connectors asymmetric, so that the mounting orientation is determined by the connector geometry itself. This inversion of the problem-solving approach resolves the contradiction between positioning accuracy and reliability.

Inventive Principle:

Principle #13The other way round (Inversion)

2Adaptability or versatility

If the semiconductor chip package is designed with symmetric connectors on opposite sides, then flexibility in mounting direction is improved, but internal circuits may be damaged due to incorrect mounting orientation

Engineering Contradiction:

Improvemounting direction flexibilityVSAvoidcircuit integrity

Core Design Contradiction:

Adaptability or versatilityVSReliability

Solution Approach 1:

The patent applies asymmetry by providing asymmetric connector arrangements on opposite sides of the insulating substrate. Specifically, the first connector has a different configuration from the second connector, creating an asymmetric overall structure that prevents incorrect mounting orientations. This resolves the contradiction by making the device inherently orientation-sensitive at the structural level, thereby improving reliability without relying solely on operator attention to indicators.

Inventive Principle:

Principle #4Asymmetry

Solution Approach 2:

The patent applies local quality by making specific local features (the connector configurations) asymmetric while the overall substrate structure remains symmetric. The asymmetric connector designs at specific locations provide orientation guidance, while the symmetric substrate layout maintains mounting flexibility. This localized application of asymmetry resolves the contradiction between adaptability and reliability.

Inventive Principle:

Principle #3Local quality

3Reliability

If asymmetric connector configurations are used on opposite sides of the insulating substrate, then positioning accuracy and reliability are improved, but device complexity increases

Engineering Contradiction:

Improvefunctional reliabilityVSAvoidconnector configuration complexity

Core Design Contradiction:

ReliabilityVSDevice complexity

Solution Approach 1:

The patent applies asymmetry by providing asymmetric connector arrangements on opposite sides of the insulating substrate. Specifically, the first connector has a different configuration from the second connector, creating an asymmetric overall structure that prevents incorrect mounting orientations. This resolves the contradiction by making the device inherently orientation-sensitive at the structural level, thereby improving reliability without relying solely on operator attention to indicators.

Inventive Principle:

Principle #4Asymmetry

Data Source

PatentUS8120164B2Semiconductor chip package, printed circuit board assembly including the same and manufacturing methods thereof

Publication Date: 2012.02.21 SAMSUNG DISPLAY CO LTD

AI summary

A semiconductor chip package and printed circuit board assembly including the same which have a variable mounting orientation include a semiconductor chip disposed on a first surface of an insulating substrate, connectors symmetrically disposed at respective first and opposite second sides of the insulating substrate, a plurality of input/output connecting leads and power connecting leads electrically connected by connecting members to a plurality of internal circuits of the semiconductor chip, at least two internal circuits of the plurality of internal circuits being substantially similar circuits, and a radiating pad disposed on a second opposite surface of the insulating substrate and which is electrically connected to the semiconductor chip.