Semiconductor Chip Package With Ceramic Antenna Thermal Dissipation
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
The demand for smaller and more advanced semiconductor packaging techniques, particularly for high-performance devices with integrated antennas, is not adequately met by existing technologies, which struggle with efficient thermal and electrical conduction and antenna design in shrinking electronic devices.
Innovation Solution
The development of a semiconductor device manufacturing process involving a redistribution structure with integrated antennas, where a semiconductor chip is encapsulated with a dielectric material and an antenna pattern is formed on a ceramic carrier, allowing for efficient thermal dissipation through a ceramic protrusion and conductive terminals, enabling improved electrical and thermal connectivity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If conventional packaging techniques are used, then manufacturing simplicity is maintained, but thermal dissipation efficiency deteriorates
Solution Approach 1:
The packaging structure is segmented into distinct functional layers: a substrate layer, a dielectric layer with embedded conductive vias, and a metal layer forming the antenna pattern. This segmentation allows each layer to be optimized independently for its specific function while maintaining overall thermal efficiency.
Solution Approach 2:
Conductive vias are introduced as intermediary elements that bridge the substrate and metal antenna layer, providing both electrical connectivity and thermal conduction pathways. These vias act as thermal mediators that efficiently transfer heat from the antenna structure to the substrate for dissipation.
2Volume of moving object
If device size is reduced, then compactness is improved, but antenna performance deteriorates
Solution Approach 1:
The antenna design transitions from a planar two-dimensional structure to a three-dimensional configuration by incorporating conductive vias that extend vertically through the dielectric layer. This dimensional transition enables the antenna to achieve resonant frequencies and radiation patterns that would be impossible in a strictly planar configuration, thereby maintaining performance in reduced device footprints.
Solution Approach 2:
The antenna structure employs composite construction combining different materials: conductive metal traces in the metal layer, dielectric material in the intermediate layer, and substrate material at the base. This composite approach allows optimization of each material's properties to simultaneously achieve miniaturization and maintain electromagnetic performance.
3Reliability
If thermal conduction is improved, then thermal resistance is reduced, but manufacturing complexity increases
Solution Approach 1:
The manufacturing process merges the formation of electrical interconnects and thermal conduction pathways into a single integrated structure. The conductive vias are formed once during the standard semiconductor fabrication process, simultaneously establishing both electrical and thermal conduits, thereby avoiding additional manufacturing steps for dedicated thermal management features.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach results in enhanced thermal dissipation efficiency, reduced thermal resistance, and compact antenna designs, addressing the challenges of shrinking device sizes and increasing performance demands.
Implementation Method 1
a heat generated from the semiconductor chip is dissipated through the redistribution circuit layer and the ceramic protrusion
Implementation Method 2
The antenna package includes an antenna pattern electrically coupled to the chip package, and conductive terminals
Data Source
AI summary
A semiconductor device including a chip package and an antenna package disposed on the chip package is provided. The chip package includes a semiconductor chip, an encapsulation enclosing the semiconductor chip, and a redistribution structure disposed on the semiconductor chip and the encapsulation and electrically coupled to the semiconductor chip. The antenna package includes an antenna pattern electrically coupled to the chip package, and an intermediate structure disposed between the antenna pattern and the chip package, wherein the intermediate structure comprises a ceramic element in contact with the redistribution structure and thermally dissipating a heat generated from the semiconductor chip.