Semiconductor Chip Package Hybrid Lead Frame and Substrate
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Solution Overview
Problem
Conventional semiconductor chip packages, such as lead frame based and ball grid array (BGA) packages, face limitations in providing an increased number of input/output connections while struggling with high fabricating costs and lower yields due to the complexity of electrical connections.
Innovation Solution
A semiconductor chip package design featuring a lead frame with a chip carrier and a package substrate where the semiconductor chip is mounted on one side and the package substrate is attached on the opposite side, allowing for additional electrical connections through bonding pads and vias, reducing the length of bonding wires and incorporating a package substrate that serves as a heat sink and provides multiple power and ground paths.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If a ball grid array (BGA) semiconductor package is used to provide greater input/output connections through solder balls, then the amount of input/output connections is increased, but the manufacturing yield decreases and fabricating cost increases
Solution Approach 1:
The patent combines the advantages of both lead frame and BGA packages by integrating a lead frame structure with a package substrate that has solder balls. The chip carrier provides traditional lead connections while the package substrate adds BGA solder ball connections, merging two connection methods into a single hybrid package that achieves high I/O count without sacrificing manufacturing yield.
Solution Approach 2:
The package substrate serves multiple functions: it provides additional solder ball connections for increased I/O, acts as a mechanical support structure, and facilitates electrical connections between the chip and external circuitry. This multi-functional design allows the package to achieve high connectivity while maintaining ease of manufacture.
2Quantity of substance
If a ball grid array (BGA) semiconductor package is used to provide greater input/output connections through solder balls, then the amount of input/output connections is increased, but the fabricating cost increases
Solution Approach 1:
The patent combines the advantages of both lead frame and BGA packages by integrating a lead frame structure with a package substrate that has solder balls. The chip carrier provides traditional lead connections while the package substrate adds BGA solder ball connections, merging two connection methods into a single hybrid package that achieves high I/O count without sacrificing manufacturing yield.
Solution Approach 2:
The package substrate serves multiple functions: it provides additional solder ball connections for increased I/O, acts as a mechanical support structure, and facilitates electrical connections between the chip and external circuitry. This multi-functional design allows the package to achieve high connectivity while maintaining ease of manufacture.
3Quantity of substance
If the semiconductor chip area is larger than the chip carrier area, then more bonding pads are available for connections, but the electrical connection length increases causing higher resistance and inductance
Solution Approach 1:
The patent utilizes the vertical dimension by extending electrical connections through the package substrate via vias. This allows bonding pads on the chip to be connected to solder balls on the bottom surface of the package substrate, creating a three-dimensional electrical connection path that reduces the horizontal trace length and associated resistance and inductance.
Solution Approach 2:
The package substrate acts as an intermediary structure that facilitates short electrical connections between the chip bonding pads and external solder balls. The substrate provides a controlled impedance path through vias and trace layers, mediating the electrical connection in a way that minimizes resistance and inductance while enabling multiple I/O connections.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design enhances electrical performance by reducing resistance and inductance, improves yield and reduces fabricating costs by simplifying the layout and increasing bonding strength, while providing a heat sink and additional electrical connections.
Implementation Method 1
incorporating a package substrate that serves as a heat sink
Data Source
AI summary
A semiconductor chip package is disclosed. The semiconductor chip package comprises a lead frame having a chip carrier, wherein the chip carrier has a first surface and an opposite second surface. A semiconductor chip is mounted on the first surface, having a plurality of bonding pads thereon, wherein the semiconductor chip has an area larger than that of the chip carrier. A package substrate comprises a central region attached to the second surface, having an area larger than that of the semiconductor chip, wherein some of the bonding pads of the semiconductor chip are electrically connected to a marginal region of the package substrate.