Semiconductor Chip Pad Configuration via Wire Bonding
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Solution Overview
Problem
Conventional semiconductor chips face increased chip area and costs due to dedicated pads for terminal configuration, and are prone to erroneous operation from bonding errors.
Innovation Solution
The semiconductor chip physically divides input/output pads to dynamically determine terminal count based on wire bonding, eliminating the need for a dedicated pad by using insulated and shorted electrodes to differentiate terminal configurations.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If a dedicated pad is added to set the number of terminals, then the semiconductor chip can be mounted on packages with different terminal counts, but the chip area increases
Solution Approach 1:
The patent combines the dedicated pad function with existing power supply or grounding pads by shorting them through wire bonding. The power supply pad or grounding pad serves dual purposes: its original function and the terminal configuration detection function, eliminating the need for a separate dedicated pad and reducing chip area.
Solution Approach 2:
The power supply pad or grounding pad is designed to perform multiple functions: providing power supply/grounding and detecting terminal configuration. By making these pads multi-functional, the patent eliminates the need for additional dedicated pads while maintaining adaptability to different package terminal counts.
2Adaptability or versatility
If a bonding wire is added to couple the dedicated pad and power supply pad, then terminal configuration can be detected, but manufacturing cost increases
Solution Approach 1:
The patent merges the terminal configuration detection function into the existing power supply or grounding pad connections. The same wire bonding that connects the power supply pad or grounding pad is used to short the dedicated pad, eliminating the need for additional bonding wires and reducing manufacturing cost.
Solution Approach 2:
The wire bonding connection serves dual purposes: providing electrical connection for power supply or grounding and detecting terminal configuration simultaneously. This multi-functional use of the bonding wire eliminates the need for separate detection wiring, reducing manufacturing cost.
3Adaptability or versatility
If bonding is used to couple the dedicated pad and power supply pad, then terminal configuration can be set, but erroneous operation occurs due to bonding errors
Solution Approach 1:
The patent incorporates error detection capability into the terminal configuration setting process. By monitoring the resistance value between the power supply pad and grounding pad after wire bonding, the system can detect bonding errors before they cause erroneous operation, preventing reliability issues.
Solution Approach 2:
The patent uses resistance measurement feedback to verify proper bonding connection. The resistance value between power supply and grounding pads is measured and compared against expected ranges, providing feedback on bonding quality and enabling detection of bonding errors that could lead to operational failures.
Data Source
AI summary
In a case where a semiconductor chip is mounted over a first package, 80 pads are coupled to 80 terminals of the package, and in a case where the semiconductor chip is mounted over a second package, 100 pads are coupled to 100 terminals of the second package. An internal circuit of the semiconductor chip operates as a microcomputer with 80 terminals in a case where electrodes are insulated from each other and operates as a microcomputer with 100 terminals in a case where the electrodes are shorted therebetween by an end part of a bonding wire. Therefore, a dedicated pad for setting the number of terminals of the packages is no longer required.