Semiconductor Chip Positioning Jig for Power Module Assembly
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Solution Overview
Problem
Existing positioning jigs for assembling power semiconductor modules fail to accurately position multiple small-sized semiconductor chips between an insulated circuit board and a terminal, leading to positional shifts and reduced manufacturing accuracy, especially with silicon carbide (SiC) diodes, which are prone to lattice defects and increased costs due to higher substrate costs.
Innovation Solution
A positioning jig with a through-hole in the terminal that allows a positioning member to be inserted, ensuring high accuracy by positioning the semiconductor chips at multiple corners and sides, preventing rotation and shift during soldering, and using a stick as a third positioning member to maintain chip position without obstructing the terminal.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If a conventional positioning jig is used to assemble power semiconductor modules, then the assembly process can be completed, but the positioning accuracy of multiple small-sized semiconductor chips deteriorates, leading to positional shifts and reduced manufacturing precision
Solution Approach 1:
The positioning jig is divided into multiple independent positioning members, each responsible for positioning specific chips at different locations. This segmentation allows each positioning member to be optimized for its specific function while maintaining overall positioning accuracy across multiple small-sized chips.
Solution Approach 2:
A third positioning member is introduced as an intermediary element to prevent rotation and positional shifts of semiconductor chips during soldering. This intermediary positioning member works in conjunction with the first and second positioning members to achieve high positioning accuracy without requiring a completely complex jig structure.
2Ease of manufacture
If the positioning jig structure is simplified to reduce device complexity, then ease of manufacture improves, but the ability to accurately position multiple small-sized chips deteriorates
Solution Approach 1:
The positioning jig is segmented into multiple independent positioning members that can be manufactured separately using standard processes, then assembled together. This segmentation simplifies the manufacturing of each individual component while maintaining the overall positioning accuracy required for multiple small-sized chips.
Solution Approach 2:
The positioning members are designed with universal features that allow them to be used for positioning different types of semiconductor chips. The first, second, and third positioning members can accommodate various chip sizes and configurations, reducing the need for multiple specialized jigs and simplifying manufacturing.
3Manufacturing precision
If multiple positioning members are used to improve positioning accuracy, then manufacturing precision improves, but the device complexity and difficulty of assembly increase
Solution Approach 1:
The positioning system is segmented into three distinct positioning members, each with a specific function: the first positioning member positions chips at initial locations, the second positioning member positions chips at other locations, and the third positioning member prevents rotation and positional shifts during soldering. This functional segmentation achieves high positioning accuracy with a manageable number of components.
Solution Approach 2:
The positioning members are designed to self-align and work together automatically during the assembly process. The third positioning member, in particular, provides self-service by automatically preventing rotation and positional shifts once the chips are positioned, reducing the need for complex control mechanisms.
4Stability of the object's composition
If a positioning member is inserted through the terminal to prevent chip rotation and shift, then positioning stability improves, but the terminal structure becomes more complex
Solution Approach 1:
The third positioning member acts as an intermediary element that passes through the terminal to provide positioning stability. This intermediary member prevents direct contact between the terminal and chip, reducing stress on the terminal structure while maintaining positioning stability during the soldering process.
Solution Approach 2:
The terminal structure is modified locally to accommodate the third positioning member, rather than redesigning the entire terminal. The through-hole for the positioning member is created only where necessary, maintaining the overall simplicity of the terminal structure while providing the needed positioning stability.
Data Source
AI summary
A method of manufacturing a semiconductor device that includes an insulated circuit board having a conductive pattern, a first semiconductor chip with a rectangular shape connected through a first joining material to the conductive pattern, a second semiconductor chip with a rectangular shape disposed on the conductive pattern separated from the first semiconductor chip and connected through a second joining material to the conductive pattern, a terminal disposed above the semiconductor chips, respectively connected to the first and second semiconductor chips through third and fourth joining materials, the terminal having a through-hole above a place between the first and second semiconductor chips, the method including a positioning step in which the first and second semiconductor chips are respectively positioned at at least three positioning places, and at least one of the positioning places is positioned with a positioning member inserted into the through-hole.