Semiconductor Chip Region Segmentation for Image Sensor Pixel Efficiency
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Solution Overview
Problem
Image sensors with rectangular silicon dies often have unused pixels at the edges due to round or distorted images from super wide field-of-view lenses, leading to inefficient image capturing and potential distortions.
Innovation Solution
A semiconductor chip with a first region dedicated to photosensitive elements for forming electric signals and a second region for other electronic circuitry, where the photosensitive elements are arranged to match the circular or distorted image area, allowing for efficient signal communication and processing.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If a rectangular silicon die is used for the image sensor, then the manufacturing process is simplified and the chip area is efficiently utilized, but pixels at the edges fall outside the circular image area formed by the lens, leading to wasted pixels and potential distortion
Solution Approach 1:
The patent divides the semiconductor chip into distinct functional regions: a first region containing photosensitive elements arranged in a rectangular array, and a second region containing electronic circuitry. This segmentation allows the photosensitive elements to be optimally positioned within the rectangular die while the lens projects a circular image onto a portion of this array, thereby utilizing the rectangular substrate efficiently without wasting pixels at the edges.
2Device complexity
If photosensitive elements are arranged in a rectangular array on the silicon die, then the chip structure is simplified and manufacturing is easier, but some pixels may lie outside the visual image circle, causing distortion and reduced image quality
Solution Approach 1:
The patent applies local quality by having photosensitive elements distributed across the rectangular first region of the semiconductor chip, while the lens projects a circular image onto a central portion of this region. This allows the rectangular array structure to be maintained for manufacturing simplicity, while the optical system is designed to project the image precisely onto the active pixel area, minimizing distortion and ensuring high image quality in the captured region.
3Ease of manufacture
If the lens projects a circular image onto a rectangular sensor array, then the lens design is simplified, but pixels at the corners and edges of the rectangular array are not utilized, leading to inefficient use of the sensor
Solution Approach 1:
The patent makes the rectangular first region of the semiconductor chip serve multiple functions: it contains the photosensitive elements arranged in a rectangular array for efficient substrate utilization, while also accommodating the circular image projection from the lens. This multi-functional design ensures that the rectangular substrate structure is fully utilized, with photosensitive elements positioned to maximize coverage of the circular image area, thereby increasing the number of active pixels without complicating the lens design.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration ensures that no significant pixels are outside the visual image, minimizing distortion and optimizing pixel usage, leading to improved image capturing efficiency and resolution distribution across the image circle.
Implementation Method 1
a set of photosensitive elements in a first region of a semiconductor chip for forming electric signals on the basis of electromagnetic radiation received by the photosensitive elements
Data Source
AI summary
The invention relates to a structure of a semiconductor chip (100) comprising photosensitive elements (104) for image capturing. The semiconductor chip (100) comprises a set of photosensitive elements (104) for forming electric signals on the basis of electromagnetic radiation received by the photosensitive elements (104); and other electronic circuitry. A surface of the semiconductor chip comprises a first region (102) and a second region (110); and the set of photosensitive elements (104) is located in the first region (102) and the other electronic circuitry is located in the second region (110). The invention also relates to methods, apparatuses, and computer program products.