Semiconductor Chip Ring-Shaped Outer Region Heat Distribution
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Semiconductor chips face uneven temperature distribution during operation, leading to localized overheating, which restricts the reduction of chip size due to waste heat generation, particularly in power semiconductor chips.
Innovation Solution
A semiconductor chip design featuring a semiconductor body with an inner region and a ring-shaped outer region, where a controllable first semiconductor component is integrated in the inner region and a second electronic component is monolithically integrated in the outer region, with the second load path electrically not connected in parallel to the first load path, effectively distributing heat more evenly across the chip.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Area of moving object
If the chip size is reduced, then the integration density is improved, but the temperature distribution becomes more uneven and localized overheating occurs
Solution Approach 1:
The chip is divided into an inner region and an outer region with distinct functional components. The inner region contains high-power components while the outer region contains low-power components, segmenting the heat generation sources to prevent concentrated overheating and enable smaller overall chip size.
Solution Approach 2:
Different regions of the chip are assigned different functional qualities - the inner region is optimized for high-power handling while the outer region handles low-power functions. This local differentiation allows efficient space utilization and heat management, enabling reduced chip size without compromising temperature distribution.
2Productivity
If high-power components are concentrated in the center, then the circuit functionality is improved, but the heat concentration causes reliability issues
Solution Approach 1:
The chip structure is segmented into inner and outer regions with different functional assignments. High-power components that generate heat are segregated into the inner region, while low-power components are placed in the outer region, preventing heat concentration and improving reliability while maintaining circuit functionality.
Solution Approach 2:
The inner region acts as an intermediary zone that contains and isolates heat-generating components. This segmentation creates a thermal buffer zone that protects the outer region and overall chip structure from excessive heat, thereby improving reliability without sacrificing functional performance.
Data Source
AI summary
One aspect of the invention relates to a semiconductor chip with a semiconductor body. The semiconductor body has an inner region and a ring-shaped outer region. An electronic structure is monolithically integrated in the inner region and has a controllable first semiconductor component with a first load path and a first control input for controlling the first load path. Further, a ring-shaped second electronic component is monolithically integrated in the outer region and surrounds the inner region. Moreover, the second electronic component has a second load path that is electrically not connected in parallel to the first load path.