Semiconductor Chip Rings for Uniform Copper Plating
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Solution Overview
Problem
The miniaturization of wiring in semiconductor devices leads to increased resistance in seed-Cu layers, resulting in non-uniform copper plating thickness due to voltage drops in the wafer middle portion, and existing solutions either generate dust or require remodeling of the plating device.
Innovation Solution
The introduction of electrically connected chip rings surrounding the chip regions acts as a low-resistance current supply path, ensuring uniform current distribution and plating thickness across the wafer surface without remodeling the plating solution or device.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If current is supplied from wafer peripheral terminals, then plating process is simple, but voltage drop occurs in wafer middle portion causing non-uniform plating thickness
Solution Approach 1:
The chip rings serve as intermediary current supply paths between the peripheral terminals and the seed-Cu layer in the wafer middle portion. These rings conduct current directly to the seed-Cu layer, acting as mediators that eliminate voltage drops and ensure uniform current distribution without requiring terminal relocation or device remodeling.
2Manufacturing precision
If a current supply source is added in the wafer middle portion to suppress voltage drop, then plating uniformity improves, but dust is generated on the wafer
Solution Approach 1:
The chip rings, which are standard structures in semiconductor manufacturing, are given a dual function: they serve both as structural elements for chip separation and as current supply paths for the plating process. This multi-functionality allows uniform plating without adding separate current supply sources that would generate dust.
3Manufacturing precision
If plating solution resistance distribution is controlled to suppress voltage drop, then plating uniformity improves, but plating device remodeling is required
Solution Approach 1:
The invention makes the chip rings self-serve as current supply paths, utilizing the existing wafer structure to provide the necessary current distribution. This self-service approach eliminates the need for external device modifications or complex plating solution formulations, maintaining manufacturing simplicity while achieving uniform plating.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach reduces voltage drops and achieves uniform copper plating thickness regardless of seed layer thickness, improving process capability and avoiding dust generation or device remodeling.
Implementation Method 1
the plurality of chip rings are electrically connected to one another
Implementation Method 2
an electrolytic plating process which is advantageous in forming fine patterns has been usually used
Data Source
AI summary
A semiconductor device according to an embodiment of the present invention includes a plurality of chip regions and a plurality of chip rings. The plurality of chip regions include semiconductor integrated circuits each having a multilayered wiring structure using a metal wiring, and are formed into independent chips. The plurality of chip rings has the multilayered wiring structure using the metal wiring, and surround the respective chip regions. The plurality of chip rings are electrically connected to one another.