Semiconductor Chip Electromagnetic Shield Film
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Solution Overview
Problem
The increasing data transfer rates in semiconductor packages within mobile wireless communication devices generate electromagnetic noise that interferes with wireless systems, and existing solutions like sheet metal shields hinder the miniaturization of these devices.
Innovation Solution
A semiconductor device chip with an electromagnetic wave shield film coated on its upper and side surfaces, grounded through a ground interconnect, replaces traditional metal sheet shields to mitigate electromagnetic noise without increasing device size or thickness.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If sheet metal shields are used to shield electromagnetic waves, then electromagnetic wave noise is effectively blocked, but the component installation area increases and device size/thickness cannot be reduced
Solution Approach 1:
The patent transitions from using two-dimensional sheet metal shields to forming a three-dimensional electromagnetic wave shield film that conforms to the contours of the semiconductor device. The shield film is applied to the side surfaces and upper surface of the semiconductor substrate, creating a dimensional transformation that provides effective shielding while adapting to the device's vertical profile rather than requiring additional horizontal space.
Solution Approach 2:
The patent employs a thin film formulation of the electromagnetic wave shield material instead of rigid sheet metal. This thin film can be applied as a coating on the semiconductor device surfaces, providing the necessary shielding function with minimal thickness and without the bulk required by traditional metal shields, thereby enabling device miniaturization.
2Object-affected harmful factors
If sheet metal shields are used to shield electromagnetic waves, then electromagnetic wave noise is effectively blocked, but device thickness increases
Solution Approach 1:
The patent uses a thin film electromagnetic wave shield material that can be applied as a coating with minimal thickness. This thin film formulation replaces thick sheet metal shields, reducing the overall device thickness while maintaining the electromagnetic shielding function through the film's material properties and strategic placement on device surfaces.
Solution Approach 2:
The shield film is applied to the side surfaces and upper surface of the semiconductor device, utilizing the vertical dimension and surface area rather than requiring additional thickness. This dimensional approach allows the shield to function effectively while keeping the device profile thin.
3Area of stationary object
If traditional metal sheet shields are replaced, then device size is reduced, but electromagnetic wave shielding capability must be maintained
Solution Approach 1:
The patent employs a thin film electromagnetic wave shield material that provides effective shielding in a space-efficient format. The thin film can be applied to the semiconductor device surfaces, maintaining shielding capability while occupying minimal space and allowing for compact device design without compromising electromagnetic interference protection.
Solution Approach 2:
The electromagnetic wave shield film is formed by coating the semiconductor device with a metal film on the side surfaces and upper surface. This composite structure combines the semiconductor device material with the metal shielding layer, creating an integrated solution that provides both device functionality and electromagnetic shielding in a compact form factor.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Effectively shields electromagnetic waves without using sheet metal shields, allowing for the reduction of mobile device size and thickness while maintaining wireless system integrity.
Implementation Method 1
an electromagnetic wave shield film for shielding electromagnetic waves, the electromagnetic wave shield film being disposed on the second surface of the semiconductor substrate and side surfaces of the function layer
Data Source
AI summary
A semiconductor device chip includes a semiconductor substrate having a first surface and a second surface opposite to the first surface, a semiconductor device disposed on the first surface of the semiconductor substrate, an interconnect pattern having an end connected to the semiconductor device and another end exposed on a surface of a function layer disposed on the first surface of the semiconductor substrate, plurality of external connection electrodes mounted on the surface of the function layer and electrically connected to the other end of the interconnect pattern, an electromagnetic wave shield film for shielding electromagnetic waves, which is disposed on the second surface of the semiconductor substrate and side surfaces of the function layer, and a ground interconnect electrically connected to the electromagnetic shield film and disposed on the function layer.