Semiconductor Chip Side Face Anti-EBO Coating for Resin Bleed Control
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Solution Overview
Problem
The excessive spreading of resin, known as 'bleed' or 'resin bleed', during the curing process of semiconductor chip attachment to leadframes, caused by the separation of the resin vehicle from the polymer adhesive, leads to inefficiencies and reliability issues in electronic device fabrication.
Innovation Solution
Applying an anti-epoxy bleed-out (anti-EBO) compound or a surface energy reducing compound on the side faces of semiconductor chips to prevent adhesive creep and minimize resin bleed, using materials like diamond-like carbon (DLC) layers or commercially available substances like T13 and BA-9, which reduce surface energy and prevent epoxy resin from spreading.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If adhesive material like epoxy resin is used to attach semiconductor chip to leadframe, then reliable electrical connection is achieved, but resin bleed and flash-off occur during curing process
Solution Approach 1:
A barrier layer is introduced as an intermediary between the adhesive material and the semiconductor chip side faces. This barrier layer prevents the resin vehicle from separating and spreading, thereby eliminating resin bleed while maintaining the adhesive's electrical connection function. The barrier layer acts as a mediator that allows the adhesive to perform its bonding function without generating harmful bleed effects.
Solution Approach 2:
The side faces of the semiconductor chip are preliminarily treated with a barrier layer before adhesive application. This preliminary action prevents the resin bleed from occurring in the first place by creating a protective surface that resists adhesive creep and monomer flashing-off during the curing process.
2Strength
If adhesive material is applied to attach chip to die pad, then chip attachment is achieved, but excessive spreading of resin occurs during curing
Solution Approach 1:
The barrier layer serves as an intermediary surface that allows strong adhesive bonding while preventing excessive resin spreading. It provides a controlled interface where the adhesive can bond effectively to the chip without creeping onto the side faces, thus maintaining manufacturing precision.
Solution Approach 2:
The barrier layer is applied specifically to the side faces of the semiconductor chip, creating a localized property difference. The top surface maintains adhesive bonding capability while the side faces gain bleed-resistant properties, allowing different regions to perform different functions.
3Strength
If cyanate-ester based adhesive is used for die attach, then bonding is achieved, but monomer flashing-off occurs during curing
Solution Approach 1:
The barrier layer acts as a mediator between the cyanate-ester adhesive and the environment, preventing the monomer from flashing-off during curing. It allows the adhesive to cure and develop full bonding strength while containing the monomer vapor within the adhesive layer.
Solution Approach 2:
By pre-applying the barrier layer to the chip side faces, the patent prevents monomer flashing-off before it can occur during the curing process. This preliminary protective action eliminates the harmful flashing-off effect while preserving the adhesive's bonding capabilities.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Effectively prevents or minimizes epoxy resin bleed and creep on semiconductor chip side faces, ensuring reliable electrical connections and improving the fabrication process by maintaining the integrity of the chip attachment, even when using cyanate-ester based adhesives.
Implementation Method 1
Applying an anti-epoxy bleed-out (anti-EBO) compound or a surface energy reducing compound on the side faces of semiconductor chips to prevent adhesive creep and minimize resin bleed, using materials like diamond-like carbon (DLC) layers or commercially available substances like T13 and BA-9, which reduce surface energy and prevent epoxy resin from spreading
Data Source
AI summary
A semiconductor chip includes a first main face and a second main face opposed to the first main face. Side faces connect the first and second main faces. The side faces are at least partially covered with an anti-EBO compound and/or a surface energy reducing compound.