Semiconductor Chip Socket Probing Window for DRAM Signal Integrity

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Solution Overview

Problem

Traditional equipment for testing high-speed dynamic random-access memories (DRAMs) faces challenges due to long transmission paths, which cause noise and distortion, making it difficult to effectively analyze these devices.

Innovation Solution

A chip socket system with a fastener featuring a probing window surrounded by side walls, allowing a probe to contact the chip directly, reducing signal transmission paths and noise by using a pedestal and fastener configuration with a top body and base body, where the probing window's first end is larger than the second end, and the side walls are inclined to facilitate direct surface contact.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Measurement precision

If traditional testing equipment is used to test high-speed DRAMs, then the testing system can be simple, but the transmission path becomes long causing noise and distortion

Engineering Contradiction:

Improvetesting accuracyVSAvoidtransmission path length

Core Design Contradiction:

Measurement precisionVSLength of stationary object

Solution Approach 1:

The patent introduces a vertical dimension by stacking the probe array above the chip in a three-dimensional configuration. This vertical arrangement allows the probes to contact the chip surface directly through the probing window, creating a short transmission path that avoids the noise and distortion problems of traditional long horizontal transmission paths.

Inventive Principle:

Principle #17Another dimension (Dimensionality change)

Solution Approach 2:

The probe array serves as an intermediary component between the testing system and the chip. By positioning the probe array in direct contact with the chip surface through the probing window, the transmission path is minimized, and signal integrity is improved while still enabling comprehensive testing of the high-speed DRAMs.

Inventive Principle:

Principle #24Intermediary (Mediator)

2Measurement precision

If the probing window opening area is reduced for better chip contact, then measurement precision improves, but probe access becomes difficult

Engineering Contradiction:

Improveprobe contact accuracyVSAvoidprobe access ease

Core Design Contradiction:

Measurement precisionVSEase of operation

Solution Approach 1:

The probing window employs local quality by having different opening areas at different ends - a larger first opening area for easy probe access and a smaller second opening area for precise chip contact. This gradient design allows the probe to be easily inserted while maintaining accurate contact with the chip surface, resolving the contradiction between accessibility and precision.

Inventive Principle:

Principle #3Local quality

Data Source

PatentUS11774491B1System and method for testing a semiconductor chip

Publication Date: 2023.10.03 NAN YA TECH

AI summary

The present application provides a testing system. The testing system includes a chip socket and a probe. The chip socket includes a pedestal and a fastener. The pedestal is configured to accommodate a chip to be tested. The fastener includes a top body and a base body. The top body includes a probing window surrounded by a plurality of side walls, wherein the probing window has a first end at an outer surface of the top body and a second end at an inner surface of the top body, a first angle between a first side wall of the plurality of side walls and the outer surface is less than 90 degrees, and a first opening area at the first end of the probing window is larger than a second opening area at the second end of the probing window.