Semiconductor Chip Joining with Protruding Solder Block
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Solution Overview
Problem
Conventional joining methods for semiconductor devices face limitations due to supply time restrictions on solder, which hinder simultaneous processing at multiple portions, thereby restricting the number of chips that can be mounted on a semiconductor device.
Innovation Solution
A joining method that involves arranging a solid joining material between two target members and melting it to solidify, allowing simultaneous joining at multiple portions without the constraints of supply time restrictions, using a solder block or plate with protruding parts to facilitate alignment and even solder distribution.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If molten solder is supplied one by one to multiple portions using a single solder supply source, then the solder can be supplied to each portion sequentially, but it takes excessive time and the supply time restricts the number of chips that can be mounted
Solution Approach 1:
The patent divides the solder supply function into multiple independent solder supply sources (first solder supply source, second solder supply source, etc.), each capable of supplying solder to different portions simultaneously. This segmentation eliminates the sequential supply bottleneck and enables parallel joining operations at multiple locations.
Solution Approach 2:
The patent combines multiple solder supply sources to operate simultaneously on multiple portions of the semiconductor device. By merging the capabilities of multiple supply sources, the system achieves parallel processing that increases productivity while maintaining joining quality through coordinated operation of all supply sources.
2Reliability
If heating time and processing speed are restricted to suppress influence on chip base material, then thermal stress is reduced, but the supply time restriction prevents simultaneous processing at multiple portions
Solution Approach 1:
The patent segments the heating and soldering process by assigning different solder supply sources to different portions, allowing each to operate independently within safe thermal parameters. This enables parallel processing without exceeding thermal limits on any single portion, thus maintaining chip integrity while reducing total processing time.
Solution Approach 2:
The patent employs preliminary arrangement of solid joining material at multiple portions before simultaneous heating. This preliminary positioning ensures that when heating begins, all portions are ready for solder supply, eliminating sequential setup time while maintaining controlled thermal exposure to protect the chip base material.
3Manufacturing precision
If solid joining material with protruding parts is used, then alignment between chip and lead frame is facilitated and solder distribution is improved, but the structure becomes more complex
Solution Approach 1:
The patent applies local quality by adding protruding parts only to the solid joining material at specific locations where alignment is needed, rather than making the entire structure complex. The protruding parts are localized features that provide alignment functionality without complicating the overall joining material design or requiring additional components.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables stable and efficient joining of semiconductor chips and lead frames at multiple portions simultaneously, increasing the number of chips that can be mounted on a semiconductor device while minimizing solder variations and thermal stress, thus extending the device's lifetime.
Implementation Method 1
by the joining material being molten and thereafter solidified, the two joining target members are joined to each other
Implementation Method 2
by the joining material being molten and thereafter solidified, the two joining target members are joined to each other
Implementation Method 3
Two joining target members, e.g., a lead frame and a chip of a semiconductor device are joined to each other with a joining material such as solder
Data Source
AI summary
A joining method that allows joining processing to be carried out simultaneously at a plurality of portions without being influenced by a supply time restriction on a joining material, and a semiconductor device manufacturing method using the joining method are provided. A chip and a lead frame are tentatively assembled having a solid solder block interposed therebetween. The solder block is provided with protruding parts that protrude in one direction. The protruding parts are inserted into solder supply ports of the lead frame, whereby the chip and the lead frame are tentatively assembled. Subsequently, the chip and the lead frame are fed into a reflow oven, and the solder block is melted and thereafter solidified. Thus, the chip and the lead frame are joined to each other.