Semiconductor Chip Surge Protection via Extraction
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Solution Overview
Problem
The existing chip-on-chip and flip-chip bonding structures face challenges in preventing surge damage to internal circuits, restricting bump layout freedom, causing uneven stress leading to deformation, and hindering resin injection for sealing.
Innovation Solution
Incorporating protection elements between power source and ground wiring, and between external connection pads and internal circuits, allowing for flexible bump placement and reducing the need for additional surge protection, while dispersing bumps to manage stress and facilitate resin injection.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If protection elements are disposed between bumps and internal circuits, then internal circuits are protected from surge, but freedom in bump layout is remarkably restricted
Solution Approach 1:
The protection element is extracted from the direct path between bump and internal circuit, and repositioned between power source wiring and ground wiring. This removes the constraint that previously forced bumps to be placed in narrow peripheral regions, while still providing surge protection through the power source wiring and ground wiring path.
Solution Approach 2:
The power source wiring and ground wiring serve as intermediary elements that mediate between the bump and the internal circuit. The protection element acts as a mediator between these intermediaries, providing surge protection without directly constraining bump placement locations.
2Reliability
If bumps are concentratedly disposed at peripheral edge portion, then surge protection is achieved, but uniformity in stress distribution is lost causing deformation
Solution Approach 1:
The requirement to concentrate bumps at peripheral edges is extracted and removed. Bumps can now be disposed at appropriate positions without being forced to peripheral locations, enabling uniform stress distribution while surge protection is maintained through the protection element between power source and ground wiring.
3Reliability
If bumps are concentrated at peripheral edge portion, then surge protection is provided, but resin injection is hindered due to narrow spacing
Solution Approach 1:
The constraint forcing bumps to peripheral edges is extracted. Bumps can be disposed at appropriate positions with adequate spacing, allowing resin to flow smoothly during injection while surge protection is maintained through the protection element configuration between power source and ground wiring.
Data Source
AI summary
A semiconductor chip according to the present invention is a semiconductor chip having a circuit forming region, in which an internal circuit including a function element is formed, on the middle portion of the surface thereof, and having the surface thereof opposed to and joined to the surface of a solid-state device. The semiconductor chips includes: a plurality of bumps, formed so as to be ridged on the surface and brought into contact with the surface of the solid-state device, for electrically connecting the internal circuit with the solid-state device; power source wiring, formed in the surrounding region of the circuit forming region, to which power source voltage is supplied; ground wiring, formed in the surrounding region of the circuit forming region, which is grounded to ground potential; and protection elements, formed between the power source wiring and the ground wiring, which electrically intervenes between the bumps and the power source wiring and between the bumps and the ground wiring, respectively.