Semiconductor Chip Temperature Sensing with Dynamic Control

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Solution Overview

Problem

Semiconductor chips face operational errors due to localized heat generation, which can lead to inaccurate temperature sensing when hotspots are not near the temperature sensor, causing improper operation or data loss.

Innovation Solution

A semiconductor system with a first chip generating temperature information using multiple temperature sensors and a second chip equipped with a temperature sensor that adjusts its operation based on this information, including a sensor activation block, voting block, compensation block, and internal control block to generate control signals for managing temperature measurement and internal operations.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Device complexity

If a single temperature sensor is used in a semiconductor chip, then the device complexity is reduced, but the measurement precision of temperature in hotspot regions deteriorates

Engineering Contradiction:

Improvetemperature sensor configurationVSAvoidtemperature sensing accuracy

Core Design Contradiction:

Device complexityVSMeasurement precision

Solution Approach 1:

The semiconductor chip is divided into multiple regions with different temperature characteristics, and temperature sensors are strategically placed in each region. This segmentation allows independent temperature monitoring of hotspot areas and non-hotspot areas, resolving the contradiction by enabling precise localized measurement without requiring a sensor throughout the entire chip.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

Different regions of the chip are assigned different measurement priorities based on their thermal characteristics. Hotspot regions receive dedicated temperature sensors for precise monitoring, while non-hotspot regions use less intensive sensing approaches. This local quality differentiation optimizes measurement precision where needed while maintaining overall system simplicity.

Inventive Principle:

Principle #3Local quality

2Measurement precision

If temperature sensors are placed in all hotspot regions, then the measurement precision is improved, but the device complexity increases

Engineering Contradiction:

Improvetemperature sensing accuracyVSAvoidtemperature sensor configuration

Core Design Contradiction:

Measurement precisionVSDevice complexity

Solution Approach 1:

Temperature sensors are pre-positioned in predicted hotspot regions based on design-stage thermal analysis and simulation. This preliminary action identifies critical measurement locations before manufacturing, allowing precise temperature monitoring in likely hotspot areas without the need for exhaustive sensor placement throughout the chip.

Inventive Principle:

Principle #10Preliminary action

Solution Approach 2:

Temperature sensor data from representative locations is used to infer temperature conditions in adjacent or similar regions. By placing sensors in strategically chosen representative positions, the system captures temperature information that can be extrapolated to cover broader areas, reducing the total number of sensors needed while maintaining measurement precision.

Inventive Principle:

Principle #26Copying

3Reliability

If temperature sensing is performed continuously, then the reliability of temperature monitoring is improved, but the use of energy increases

Engineering Contradiction:

Improvetemperature monitoring reliabilityVSAvoidpower consumption

Core Design Contradiction:

ReliabilityVSUse of energy by moving object

Solution Approach 1:

Temperature sensing is performed periodically rather than continuously, with the sensing interval dynamically adjusted based on operational conditions. During normal operation, sensing occurs at longer intervals to conserve energy, while during high-activity periods or when hotspots are detected, the sensing frequency increases to maintain reliability.

Inventive Principle:

Principle #19Periodic action

Solution Approach 2:

The temperature monitoring system dynamically adapts its operation based on real-time conditions. When temperature changes are detected or when the chip enters high-performance modes, the system increases monitoring intensity. During stable, low-power states, monitoring frequency is reduced, optimizing the balance between reliability and energy consumption.

Inventive Principle:

Principle #15Dynamics

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

Prevents erroneous operations by accurately measuring and managing temperature across the chip, ensuring optimal refresh intervals and preventing data loss in memory cells, even when hotspots are not near the temperature sensor.

Implementation Method 1

a second temperature sensor configured to measure a temperature in the second chip and generate second temperature information according to the measured temperature

Methodology Applied

Scientific EffectTemperature sensing:

Data Source

PatentUS10985139B2Semiconductor chip for sensing temperature and semiconductor system including the same

Publication Date: 2021.04.20 SAMSUNG ELECTRONICS CO LTD

AI summary

In one example embodiment, a semiconductor system includes a first chip configured to generate first temperature information of the first chip, the first temperature information being based on at least one temperature measurement using at least one first temperature sensor. The semiconductor system further includes a second chip including a second temperature sensor configured to be controlled based on at least the first temperature information.