Semiconductor Chip Temperature Detection via Series Resistor

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Solution Overview

Problem

Existing semiconductor devices and power conversion systems cannot accurately detect the temperature of semiconductor chips without increasing the number of components, as traditional methods rely on thermistors or temperature sensor diodes.

Innovation Solution

A semiconductor device that includes a semiconductor chip with a temperature-dependent internal resistor, an external resistor connected in series, and a detector to calculate the chip's temperature by measuring voltages across both resistors, allowing temperature detection without additional on-chip components.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Measurement precision

If a thermistor is used to detect temperature, then the ambient temperature of the chip can be detected, but the temperature of the chip itself cannot be detected

Engineering Contradiction:
Improvechip temperature detection accuracyVSAvoidtemperature detection reliability
Core Design Contradiction:
Measurement precisionVSReliability

Solution Approach 1:

An external resistor is introduced as an intermediary component connected in series with the semiconductor chip. By measuring the voltage division across this external resistor and the chip's internal resistance, the system can calculate the chip's temperature indirectly through the temperature-dependent resistance characteristics, avoiding direct contact with the chip while achieving accurate temperature measurement.

Inventive Principle:
Principle #24Intermediary (Mediator)

2Measurement precision

If a temperature sensor diode is used to detect chip temperature, then accurate chip temperature detection is possible, but the number of components on the chip increases

Engineering Contradiction:
Improvechip temperature detection accuracyVSAvoidnumber of components
Core Design Contradiction:
Measurement precisionVSDevice complexity

Solution Approach 1:

The temperature sensing function is extracted from the chip itself and implemented externally using a separate resistor and detection circuit. This extraction allows the chip to maintain its original component structure while achieving temperature detection capability through external components that measure the voltage division caused by the chip's temperature-dependent resistance.

Inventive Principle:
Principle #2Taking out (Extraction)

3Measurement precision

If additional temperature sensing components are added to the chip, then chip temperature can be detected, but assembly difficulty and manufacturing complexity increase

Engineering Contradiction:
Improvechip temperature detection accuracyVSAvoidassembly difficulty
Core Design Contradiction:
Measurement precisionVSEase of manufacture

Solution Approach 1:

The external resistor serves multiple functions: it acts as a current limiting resistor for the LED, a sensing element for temperature measurement, and part of the voltage division circuit. This multi-functionality eliminates the need for separate temperature sensor components, simplifying the overall device structure and reducing assembly complexity while maintaining accurate temperature detection capability.

Inventive Principle:
Principle #6Universality (Multi-functionality)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

Enables accurate temperature detection of semiconductor chips without increasing component count, improving assemblability and productivity, and enabling efficient operation by using wide-band-gap semiconductors for reduced power loss and downsized devices.

Implementation Method 1

resistance of which changes in accordance with temperature

Methodology Applied
Scientific EffectTemperature-dependent resistance: Electrical Resistance

Data Source

PatentUS10564048B2Semiconductor device and power conversion device
Publication Date: 2020.02.18 MITSUBISHI ELECTRIC CORP
  • US10564048B2 patent drawing
  • US10564048B2 patent drawing
  • US10564048B2 patent drawing

AI summary

According to the present invention, a semiconductor device includes a semiconductor chip, resistance of which changes in accordance with temperature, an external resistor connected in series with the semiconductor chip and a detector configured to detect, while a first voltage is applied between both ends of a series circuit formed by the semiconductor chip and the external resistor, a second voltage applied between both ends of the external resistor, wherein the detector calculates a temperature of the semiconductor chip from the second voltage.