Semiconductor Chip Vertical Contact Structure
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Solution Overview
Problem
Existing semiconductor chips often have restricted functional areas due to lateral offset contacts, leading to geometrical deviations from desired square or rectangular shapes, resulting in wasted valuable area during separation and increased logistical complexity.
Innovation Solution
A semiconductor chip with a semiconductor body and carrier arranged vertically, featuring a non-rectangular shape with a top side contact that allows for a rectangular or square radiation exit area, and a contact region that is offset laterally, enabling efficient area usage and simple separation methods to produce identical chips without wasting valuable area.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of operation
If a lateral offset contact strip is provided for contacting the semiconductor body, then the contact function is achieved, but the functional area (radiation exit area) is restricted and deviates from desired square or rectangular shape
Solution Approach 1:
The contact strip is extended in the vertical direction (z-direction) to form a three-dimensional contact structure that rises from the chip surface. This vertical extension allows the contact to be made without lateral offset, preserving the square or rectangular shape of the radiation exit area while still providing adequate contact area through the vertical dimension rather than horizontal extension
2Ease of operation
If a lateral offset contact strip with minimum dimensions is provided, then the contact function is achieved, but a not inconsiderable part of the elongate strip is left unused, wasting valuable area
Solution Approach 1:
Instead of extending the contact strip laterally in the x-y plane which wastes area, the contact structure is extended vertically in the z-direction. This dimensional change allows the contact area to be increased without consuming additional lateral space, thereby eliminating waste of valuable chip area while maintaining adequate contact dimensions
Solution Approach 2:
The contact structure parameters are changed from a two-dimensional lateral strip to a three-dimensional vertical structure. By changing the geometric parameters from horizontal extension to vertical extension, the contact area is optimized without increasing the lateral footprint, thus preventing waste of valuable chip area
3Ease of operation
If the semiconductor body is cut out laterally to provide contact accessibility, then the contact function is achieved, but the area of the semiconductor body and functional area deviates from desired square or rectangular shape
Solution Approach 1:
Instead of laterally cutting out the semiconductor body to access contacts, the contact structure itself is extended vertically to provide accessibility. This eliminates the need for lateral cutting while preserving the square or rectangular shape of the semiconductor body and radiation exit area
Data Source
AI summary
The invention concerns a semiconductor chip (100) with a semiconductor body (2) having a semiconductor layer sequence, and with a substrate body (4) and at least one upper side contact (8). In projection the semiconductor chip (100) has a shape which deviates from a rectangular shape. The invention also concerns a method of separating a composite into a plurality of semiconductor chips (100) along a separation pattern (15) with the steps enabling a plurality of semiconductor chips according to the invention to be produced.