Semiconductor Chuck Vacuum Line Geometry for Byproduct Control
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
The buildup of processing byproducts in the vacuum chuck and plumbing fixtures of semiconductor processing tools reduces the effectiveness of the vacuum chuck in securing semiconductor devices, leading to decreased productivity due to frequent maintenance needs.
Innovation Solution
An improved chuck vacuum line design with a first portion penetrating the sidewall of the main pumping line and a second portion that is substantially parallel to the sidewall and flow direction, with a size increase from inlet to outlet, which reduces buildup on the interior walls and maintains airflow, preventing clogging.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a conventional vacuum chuck and plumbing fixture design is used, then the semiconductor device can be secured in place, but processing byproducts accumulate in the vacuum chuck and plumbing fixtures, reducing effectiveness and requiring frequent maintenance
Solution Approach 1:
The patent extracts the harmful buildup problem by designing a specific plumbing fixture configuration where the vacuum line penetrates the sidewall of the process chamber at a location that prevents byproduct accumulation. The vacuum line is positioned to draw air flow that bypasses regions where byproducts would otherwise accumulate, effectively removing the harmful accumulation issue from the system.
Solution Approach 2:
The patent introduces an intermediary airflow path through the vacuum line that acts as a mediator between the process chamber and the vacuum pump. This intermediary flow carries away processing byproducts before they can accumulate in the vacuum chuck or plumbing fixtures, preventing the reliability degradation over time.
2Ease of operation
If the vacuum line penetrates the process chamber sidewall, then air flow can be maintained and byproduct buildup prevented, but the structural integrity and sealing of the process chamber must be maintained
Solution Approach 1:
The patent applies local quality by creating a specialized penetration structure in the process chamber sidewall that is different from the rest of the chamber structure. The vacuum line penetration includes specific features such as sealing arrangements and positioning that are tailored to this local location, maintaining the overall chamber integrity while enabling the required airflow function at this specific point.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design enhances the vacuum chuck's effectiveness in securing devices, reduces maintenance frequency, and improves temperature control and uniformity in the process chamber, increasing the tool's productivity and performance.
Implementation Method 1
A vacuum chuck may be connected to one or more plumbing fixtures (e.g., tubes, pipes, valves, and/or the like) through which air is sucked from the chamber via one or more openings in the vacuum chuck to create an air pressure differential in the chamber.
Data Source
AI summary
A chuck vacuum line of a semiconductor processing tool includes a first portion that penetrates a sidewall of a main pumping line of the semiconductor processing tool. The chuck vacuum line includes a second portion that is substantially parallel to the sidewall of the main pumping line and to a direction of flow in the main pumping line. A size of the second portion increases between an inlet end of the second portion and an outlet end of the second portion along the direction of flow in the main pumping line.