Chuck unit and method for controlling temperature of the chuck unit

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Solution Overview

Problem

Existing chuck units for semiconductor devices cannot effectively cool below room temperature and accelerate the deterioration of Peltier modules when used at high temperatures.

Innovation Solution

A chuck unit with a heating part, a fluid-cooling air-cooling block, and a Peltier module, where the heater is energized when the cooling block and Peltier module are spaced apart, and the heater is cut off during contact to prevent overheating and deterioration of the Peltier module.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Temperature

If a Peltier module is used to cool the chuck below room temperature, then the cooling capability is improved, but the module deteriorates accelerated when it contacts the heater at high temperatures

Engineering Contradiction:

Improvecooling capabilityVSAvoidPeltier module durability

Core Design Contradiction:

TemperatureVSReliability

Solution Approach 1:

The cooling function is divided into two separate modules: a Peltier module for below-room-temperature cooling and a fluid-cooling block for high-temperature cooling. This segmentation allows each module to operate within its optimal temperature range, preventing the Peltier module from contacting the heater at high temperatures and thus reducing deterioration while maintaining cooling capability.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The fluid-cooling block acts as an intermediary between the heater and the Peltier module. During high-temperature operations, the fluid-cooling block absorbs excess heat, preventing direct thermal contact between the heater and the temperature-sensitive Peltier module, thereby protecting the module from accelerated deterioration.

Inventive Principle:

Principle #24Intermediary (Mediator)

2Device complexity

If a metal block is used for cooling, then the cooling structure is simple, but the temperature cannot go below room temperature

Engineering Contradiction:

Improvecooling structure simplicityVSAvoidminimum temperature

Core Design Contradiction:

Device complexityVSTemperature

Solution Approach 1:

The conventional metal block cooling system is replaced with a Peltier module, which uses the Peltier effect (electrothermal conversion) instead of pure thermal conduction. This substitution enables active cooling below room temperature by using electrical current to pump heat from the chuck to the heat sink, achieving sub-ambient temperatures that passive metal block cooling cannot provide.

Inventive Principle:

Principle #28Mechanics substitution (Replace mechanical system)

3Productivity

If the heater is continuously energized to maintain high temperature, then the heating efficiency is improved, but the Peltier module deteriorates accelerated when in contact

Engineering Contradiction:

Improveheating efficiencyVSAvoidPeltier module durability

Core Design Contradiction:

ProductivityVSReliability

Solution Approach 1:

The system dynamically adjusts the cooling configuration based on temperature requirements. During high-temperature heating operations, the fluid-cooling block is positioned to absorb heat while the Peltier module is spaced apart from the heater. During low-temperature operations, the Peltier module is brought into contact with the chuck for efficient cooling. This dynamic reconfiguration allows continuous heater operation at high temperatures without damaging the Peltier module.

Inventive Principle:

Principle #15Dynamics

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

Enables temperature control from below freezing to high temperatures while reducing Peltier module deterioration by separating the Peltier module from the air-cooling block during high-temperature operations.

Implementation Method 1

a heating part including a heater and configured to heat the chuck

Methodology Applied

Scientific EffectJoule heating: Joule Heating

Implementation Method 2

a cooling block configured to cool the heating part by using fluid-cooling

Methodology Applied

Scientific EffectFluid cooling: Convection

Implementation Method 3

a Peltier module configured to cool the cooling block

Methodology Applied

Scientific EffectPeltier effect: Peltier Effect

Data Source

PatentUS11486895B2Chuck unit and method for controlling temperature of the chuck unit

Publication Date: 2022.11.01 HISOL

AI summary

A chuck unit includes a chuck on which a semiconductor is mounted, a heating part including a heater and configured to heat the chuck, a cooling block configured to cool the heating part by using fluid-cooling, and a Peltier module configured to cool the cooling block. The heater is configured to be energized while the cooling block and the Peltier module are spaced apart from each other, and the heater is configured to be cut off from energization while the cooling block and the Peltier module contact each other.