Semiconductor Device Circuit Plate Adhesion
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Solution Overview
Problem
The existing semiconductor devices face issues with the peeling of thermosetting resin sealing material from the circuit plate of the insulating substrate due to differences in adhesive properties and thermal expansion coefficients, leading to potential disruptions in bonding wires and increased manufacturing costs from forming numerous micro recessed parts.
Innovation Solution
The semiconductor device incorporates a circuit plate formed as a combination of a circuit pattern and a sealing material adhering pattern, where the sealing material contacts the insulating resin plate, enhancing adhesive properties between the thermosetting resin and the insulating resin plate, thereby preventing peeling and reducing manufacturing complexity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If micro recessed parts are formed on the circuit plate to improve adhesive properties, then adhesive strength between sealing material and circuit plate is improved, but manufacturing time and cost increase
Solution Approach 1:
The invention applies local quality by providing adhesive promotion parts only in specific regions where peeling is likely to occur, rather than forming micro recessed parts across the entire circuit plate surface. The adhesive promotion parts are strategically positioned at the periphery and in regions prone to peeling, thus improving adhesive strength locally without the need for extensive micro recessed part formation across the whole surface, reducing manufacturing complexity while maintaining bonding strength.
Solution Approach 2:
The invention segments the adhesive promotion function into distinct regions: peripheral adhesive promotion parts at the edges of the circuit plate and internal adhesive promotion parts in the central region. This segmentation allows targeted adhesive enhancement in areas most susceptible to peeling, avoiding unnecessary manufacturing steps in regions where adhesion is already sufficient, thereby balancing adhesive strength improvement with manufacturing efficiency.
2Reliability
If sealing material adheres to circuit plate, then electrical connection is achieved, but peeling occurs due to thermal expansion differences
Solution Approach 1:
The invention addresses peeling resistance by providing adhesive promotion parts in specific locations where thermal stress and peeling are most likely to occur, such as the periphery of the circuit plate and regions with high thermal expansion differential. These localized adhesive promotion features enhance bonding strength precisely where needed, preventing peeling without requiring modification of the entire circuit plate surface, thus maintaining connection reliability while resisting thermal-induced peeling.
Solution Approach 2:
The adhesive promotion parts serve as pre-prepared cushioning elements that compensate for the thermal expansion differences between the sealing material and circuit plate before peeling can occur. By having enhanced adhesive regions in advance at critical locations, the structure can withstand repeated thermal cycling without developing peeling defects that would compromise connection reliability.
3Strength
If sealing material has high adhesion to circuit plate, then peeling is prevented, but adhesive properties are insufficient due to material differences
Solution Approach 1:
The invention provides adhesive promotion parts with specific surface characteristics that enhance adhesion locally without requiring the entire sealing material or circuit plate to have modified properties. The adhesive promotion parts are formed with features such as increased surface area, different surface energy, or localized roughness that improve bonding specifically at critical interfaces, overcoming material incompatibility issues without requiring changes to the bulk materials.
Solution Approach 2:
The invention changes local parameters of the adhesive interface by providing adhesive promotion parts with modified surface properties such as increased surface area, altered surface energy, or different chemical composition at specific locations. These parameter changes enhance adhesive compatibility and peeling resistance at critical regions without requiring changes to the overall material composition or manufacturing process of the entire sealing structure.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration improves the adhesive strength between the sealing material and the insulating resin plate, preventing peeling and maintaining the integrity of bonding wires, while also reducing production time and costs by simplifying the manufacturing process.
Implementation Method 1
the sealing material contacts the insulating resin plate, enhancing adhesive properties between the thermosetting resin and the insulating resin plate
Implementation Method 2
the sealing material is different from the circuit plate in thermal expansion coefficient. Therefore, the sealing material is liable to peel off from the interface between the sealing material and the circuit plate of the insulating substrate because heat is generated repeatedly
Data Source
AI summary
A semiconductor device includes an insulating substrate having a metal plate, an insulating resin plate, and a circuit plate laminated in order; a semiconductor element fixed to the circuit plate; a wiring member connected to an electrode disposed on a front surface of the semiconductor element or to the circuit plate of the insulating substrate; a housing accommodating the insulating substrate, the semiconductor element, and the wiring member; and a sealing material including a thermosetting resin, and sealing the insulating substrate, the semiconductor element, and the wiring member accommodated in the housing. The circuit plate of the insulating substrate is selectively formed on the insulating resin plate as a combination of a circuit pattern with a sealing material adhering pattern.