Semiconductor Circuit Design Using Aging SPICE Simulation
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Solution Overview
Problem
Current SoC chip design reliability analysis relies on worst-case assumptions, leading to overdesign and inefficiencies due to the lack of consideration for actual usage conditions, such as voltage and temperature variations, which results in pessimistic estimates of electrical characteristics and performance optimization.
Innovation Solution
A semiconductor device design system that incorporates an aging spice model, netlist, modes of operation, aged database, and simulator to simulate the effects of device aging under various usage conditions, optimizing the characterization of timing libraries and reducing the design margin by considering specific operating modes and their impact on electrical characteristics.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If worst-case assumption is used for reliability analysis, then reliability estimate is conservative, but design margin is excessive and overdesign occurs
Solution Approach 1:
The patent changes the parameter of reliability analysis from worst-case assumption to usage-condition-based simulation. By introducing usage conditions (voltage, temperature, time variations) as simulation parameters, the system calculates actual aging effects rather than relying on conservative estimates, thereby reducing excessive design margin while maintaining adequate reliability.
Solution Approach 2:
The patent replaces the mechanical/conventional approach of worst-case assumption with a simulation-based approach using SPICE tools. This substitution allows for more precise calculation of aging effects under actual usage conditions, replacing the overly conservative mechanical methodology with a more sophisticated computational approach.
2Reliability
If worst-case assumption is used, then reliability is ensured, but power consumption and manufacturing cost increase due to overdesign
Solution Approach 1:
The patent changes the reliability analysis parameters from fixed worst-case values to dynamic usage-condition-based parameters. By simulating aging effects under actual voltage, temperature, and time variations, the system determines optimal design margins that balance reliability with power consumption, eliminating unnecessary power reserves required by overdesign.
3Measurement precision
If usage conditions are considered in simulation, then design accuracy is improved, but simulation time and computational complexity increase
Solution Approach 1:
The patent applies preliminary action by pre-defining usage conditions and aging models before simulation. By preparing usage condition scenarios (voltage, temperature, time profiles) in advance and pre-configuring the SPICE simulation framework, the system reduces actual simulation time while maintaining high accuracy in predicting electrical characteristics under varying conditions.
Data Source
AI summary
A method performed by a processor, the method including preparing a netlist describing a first circuit including an active component; obtaining an original electrical characteristic of the active component, wherein an electrical characteristic of the active component is the original electrical characteristic in a condition that the active component has not been operated; obtaining an aged data describing a variation in the original electrical characteristic, wherein the variation is caused by operating the first circuit under a first mode and a second mode different from the first mode during a time period; providing a simulation result by simulating, based on an aged electrical characteristic, the first circuit operating under the first mode and the second mode during the time period, wherein the aged electrical characteristic is a combination of the original electrical characteristic and the variation.