Semiconductor Circuit Assembly Thermal Expansion Pressure
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Solution Overview
Problem
Existing semiconductor circuit arrangements face inefficiencies in thermal coupling between the circuit substrate and heat sink, leading to suboptimal heat transfer.
Innovation Solution
The semiconductor circuit arrangement incorporates pressure elements with cavities and thermomechanical force knobs, where the pressure bodies, potentially made of silicone with a higher coefficient of thermal expansion than the housing material, expand to press the circuit substrate against the heat sink, enhancing thermal dissipation through thermomechanical forces.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If pressure elements are used to press the circuit substrate against the heat sink, then thermal coupling is improved, but the contact pressure decreases as temperature increases due to thermal expansion
Solution Approach 1:
The patent applies thermal expansion by selecting materials with different coefficients of thermal expansion for the pressure element and housing. The pressure element has a higher coefficient of thermal expansion than the housing, so when temperature increases, the pressure element expands more than the housing, maintaining or increasing the contact pressure between the circuit substrate and heat sink despite the initial problem of pressure loss.
2Ease of manufacture
If the housing is made of plastic material, then manufacturing ease is improved, but dimensional stability deteriorates
Solution Approach 1:
The patent employs composite materials by combining plastic housing material with metal inserts. The metal inserts are embedded in the plastic housing to provide localized areas of high dimensional stability and stiffness, particularly in regions where precision is critical, while maintaining the overall ease of manufacture and cost benefits of using plastic for the housing structure.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design significantly reduces thermal resistance between the circuit substrate and heat sink, allowing for improved heat dissipation as the semiconductor circuit arrangement heats up, optimizing cooling efficiency.
Implementation Method 1
the pressure bodies, potentially made of silicone with a higher coefficient of thermal expansion than the housing material, expand to press the circuit substrate against the heat sink
Implementation Method 2
the thermal resistance between the circuit substrate and the heat sink is correspondingly reduced
Data Source
Figure 1~2
AI summary
The arrangement (10) has a circuit substrate (14) including a housing (12) that is provided with semiconductor components (20) and arranged on a cooling body (24). The housing is formed with a pressure element (26), which includes a knob-shaped pressure body (28) to be made of material whose thermal expansion coefficient is larger than material of the housing. The housing is formed with hollow cavities (30) of the pressure body that is provided with a head section (32) from the hallow cavities. A metal insert is embedded in the housing and formed by a metallic sheet.