Semiconductor Integrated Circuit with Segmented Insulating Layer
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Solution Overview
Problem
Conventional high-voltage ICs in power conversion bridge circuits are prone to malfunction and damage due to wide voltage ranges, which result in noise input, leading to reliability issues and weak bond integrity when forming modules.
Innovation Solution
A semiconductor integrated circuit design featuring a semiconductor substrate with specific well regions, an insulating layer, and a rear surface electrode layer, along with a bonding layer for improved adhesion to a circuit board, enhancing noise tolerance and bond integrity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If an insulating adhesive is used to electrically insulate the high-voltage IC chip from the circuit board island, then noise tolerance and reliability are improved, but bond integrity and adhesion strength deteriorate
Solution Approach 1:
The insulating structure is segmented into multiple functional layers: a lower insulating layer (first insulating layer) that provides electrical isolation and noise tolerance, and an upper insulating layer (second insulating layer) that provides bonding surface and adhesion. This segmentation allows each layer to optimize for its specific function without compromising the other.
Solution Approach 2:
The patent introduces an intermediary bonding structure between the IC chip and circuit board that combines insulating and bonding functions. The lower insulating layer acts as an intermediary that provides electrical isolation while the upper insulating layer serves as an intermediary bonding surface, mediating between the electrical isolation requirement and the mechanical bonding requirement.
2Reliability
If the insulating adhesive layer is made thicker to improve electrical insulation, then noise tolerance improves, but adhesion strength and bond integrity worsen
Solution Approach 1:
The insulating structure is divided into two distinct layers with different thicknesses and functions. The lower insulating layer has sufficient thickness for electrical insulation and noise tolerance, while the upper insulating layer provides a bonding surface with appropriate thickness for adhesion. This segmentation resolves the contradiction by distributing the functional requirements across different layers rather than requiring a single thick layer.
Solution Approach 2:
Different regions of the insulating structure have different properties optimized for local requirements. The lower insulating layer has properties optimized for electrical insulation (greater thickness, higher dielectric strength), while the upper insulating layer has properties optimized for bonding (appropriate thickness, surface characteristics for adhesion). This local quality differentiation allows simultaneous achievement of electrical insulation and bonding strength.
Data Source
AI summary
A semiconductor integrated circuit includes a semiconductor substrate of a first conductivity type, a first well region of a second conductivity type formed in an upper portion of the semiconductor substrate, a second well region of the first conductivity type formed in an upper portion of the first well region, an insulating layer formed separated from the first well region on a bottom portion of the semiconductor substrate that is directly beneath the first well region, and a rear surface electrode layer formed on a bottom of the insulating layer.