Semiconductor Structure Clamping for Gravity-Free 3D Measurement
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Solution Overview
Problem
Current OCD measurement technologies face challenges in achieving high accuracy due to micro deformations in semiconductor structures caused by gravity, leading to inaccurate measurements of three-dimensional morphology.
Innovation Solution
A measurement device and method that includes a clamping mechanism with a clamp disposed along a vertical direction to clamp the semiconductor structure, ensuring the to-be-measured surface faces the side, and an image acquisition system to acquire the three-dimensional morphology from the side, thereby reducing the influence of gravity and improving measurement accuracy.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of operation
If the semiconductor structure is placed horizontally on the measurement platform, then the measurement process is simple, but gravity causes micro deformations and warping of the structure leading to measurement inaccuracies
Solution Approach 1:
The patent inverts the traditional horizontal placement of the semiconductor structure to a vertical clamping configuration. The clamp is disposed along the vertical direction, causing the semiconductor structure to be clamped vertically with the to-be-measured surface facing the side. This inversion eliminates gravity-induced deformations while maintaining measurement capability through side-facing image acquisition.
Solution Approach 2:
The patent transitions from horizontal (2D plane) placement to vertical (3D space) clamping. By changing the spatial dimension and orientation of the semiconductor structure from horizontal to vertical, the measurement system avoids gravity's harmful effects while preserving the ability to capture three-dimensional morphology through side-facing imaging.
2Measurement precision
If the semiconductor structure is clamped vertically to eliminate gravity influence, then measurement accuracy improves, but the device complexity increases
Solution Approach 1:
The patent extracts the semiconductor structure from the horizontal measurement plane and repositions it vertically through the clamping mechanism. This extraction from the traditional measurement configuration allows gravity to act perpendicular to the measurement surface, eliminating its distorting effect on the three-dimensional morphology being measured.
Solution Approach 2:
The clamping mechanism serves as an intermediary device that facilitates the vertical positioning of the semiconductor structure. By introducing this intermediate clamping system, the patent enables vertical orientation without requiring complete redesign of the measurement platform, thus managing device complexity while achieving measurement precision.
3Measurement precision
If the to-be-measured surface faces the side during vertical clamping, then gravity impact is reduced, but the image acquisition system positioning becomes more complex
Solution Approach 1:
The clamping mechanism is designed with multi-functionality, serving both to secure the semiconductor structure vertically and to position the to-be-measured surface in the correct orientation for side-facing image acquisition. This universal design integrates clamping and positioning functions, reducing the need for separate adjustment mechanisms and managing system complexity.
Data Source
AI summary
A measurement device and method for a semiconductor structure are provided. The measurement device for the semiconductor structure includes a bearing platform, a clamping mechanism, and an image acquisition system. The clamping mechanism is installed on the bearing platform and includes a clamp disposed along a vertical direction. The clamp is configured to clamp the semiconductor structure such that the semiconductor structure is clamped with a to-be-measured surface facing a side. The image acquisition system is disposed by a side of the clamping mechanism, and is configured to acquire a three-dimensional morphology of the semiconductor structure from the side.