Semiconductor device
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Conventional semiconductor devices face challenges in efficiently managing energy generated by electromotive force during current turn-off, leading to potential excessive temperature rise and reduced energy absorption through active clamping.
Innovation Solution
The semiconductor device incorporates a covering part with higher thermal conductivity than the sealing resin, interposed between the first electrode and the first object, along with an insulating layer and a metal layer, to facilitate heat transfer and increase energy absorption during active clamping.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Loss of energy
If a conventional semiconductor device structure is used, then the device is simple to manufacture, but energy generated during current turn-off causes excessive temperature rise and reduced energy absorption
Solution Approach 1:
A covering part with high thermal conductivity is introduced as an intermediary between the first electrode and the first object. This covering part acts as a heat transfer mediator that conducts energy generated during current turn-off from the electrode to the first object, enabling effective energy absorption and preventing excessive temperature rise in the semiconductor element.
Solution Approach 2:
The thermal conductivity parameter of the material between the electrode and the first object is changed by introducing a covering part with higher thermal conductivity than the sealing resin. This parameter change enhances the heat transfer capability, allowing more efficient energy dissipation and preventing temperature accumulation during active clamping operations.
2Temperature
If thermal conductivity is increased to improve heat dissipation, then energy absorption is enhanced, but device structure becomes more complex
Solution Approach 1:
The covering part serves multiple functions simultaneously: it provides high thermal conductivity for heat dissipation, offers structural support between the electrode and first object, and maintains electrical insulation when made of appropriate materials. This multi-functionality reduces the need for additional separate components, thereby limiting the increase in device complexity while achieving improved heat dissipation.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration effectively reduces excessive temperature rise and enhances energy absorption, improving the semiconductor device's operational efficiency and functionality by promoting uniform heat dissipation and energy management.
Implementation Method 1
a covering part interposed between the first electrode and the first object, and containing a material having a higher thermal conductivity than the sealing resin
Data Source
AI summary
A semiconductor device includes a first semiconductor element, a first object, a sealing resin and a covering part. The first semiconductor element includes a first electrode. The first object includes a first surface facing the first electrode. The sealing resin covers the first semiconductor element and the first object. The covering part is interposed between the first electrode and the first surface and contains a material having a higher thermal conductivity than the sealing resin.