Semiconductor Clamping Device Uniform Compression Force
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing semiconductor clamping devices with a single pressure distribution member often result in unequal compression forces across the interfacing planar surfaces of semiconductor devices and associated components, leading to isolated hot spots due to design advancements in larger, disc-type semiconductor devices.
Innovation Solution
A clamping device with a pair of opposing jaws joined by tie rods, featuring clamp pressure set point assemblies with adjustable elements and indicators, applies a uniform compression force across semiconductor devices and components by initially applying half the desired force between the jaws and adjusting to ensure equal pressure distribution using washers and nuts.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If a single pressure distribution member is used to clamp semiconductor devices, then the device structure is simple, but the compression force distribution becomes uneven across the planar surfaces
Solution Approach 1:
The single pressure distribution member is divided into multiple pressure distribution members arranged in an array. Each member independently applies compression force to a specific region of the semiconductor device, ensuring uniform pressure distribution across the entire planar surface while maintaining structural simplicity through modular repetition.
2Ease of manufacture
If a single pressure distribution member is used, then the clamping device is easier to manufacture, but isolated hot spots occur due to unequal compression forces
Solution Approach 1:
Multiple pressure distribution members are distributed across the clamping device to ensure uniform compression force application. This segmentation prevents isolated hot spots by eliminating pressure concentration points, while the modular design maintains ease of manufacture through standardized components.
Solution Approach 2:
Each pressure distribution member is positioned to apply compression force to a specific local region of the semiconductor device. This local quality approach ensures that every area receives appropriate pressure, preventing hot spots while maintaining overall manufacturing simplicity through repeated standard components.
3Ease of operation
If compression force is applied by tightening nuts on tie rods, then assembly is completed, but it is difficult to detect and measure the actual compression force without pressure gauges
Solution Approach 1:
The clamp pressure set point assembly incorporates a set point element with a indicator that automatically displays when the desired compression force is achieved. This self-indicating mechanism eliminates the need for external pressure gauges or complex measurement equipment, allowing operators to easily detect when proper compression is reached during assembly.
Solution Approach 2:
The indicator element provides immediate visual feedback to the operator during the tightening process. When the indicator shows that the set point has been reached, it confirms that the desired compression force has been applied, enabling easy detection and measurement without requiring additional instrumentation.
Data Source
AI summary
The present invention relates to a method of clamping a semiconductor assembly with a desired compression force equally distributed across the opposing surfaces of the devices and associated components of the semiconductor assembly.