Semiconductor Substrate Cleaner for Silicone Adhesive Removal
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Solution Overview
Problem
Current cleaning agents fail to efficiently remove silicone-based adhesive residues from semiconductor substrates without causing corrosion, particularly when the substrates have a high water contact angle, leading to potential defects in subsequent processing steps.
Innovation Solution
A cleaner composition comprising 90.0 to 99.9% organic solvent, 0.1 to 10.0% alcohol with 3 to 6 carbon atoms, and 20 to 300 ppm of sodium and/or potassium, which is substantially free of water, effectively removes silicone adhesive residues from semiconductor substrates without causing corrosion, even when the substrates have a high water contact angle.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If only an organic solvent is used to dissolve the adhesive, then the substrate surface can be cleaned, but the residual adhesive cannot be fully removed and the cleaning time is extended
Solution Approach 1:
The patent combines multiple cleaning agents into a single composition: an organic solvent (for dissolving adhesive), an alcohol component (for removing silicone residues), and an alkaline substance (for enhancing cleaning effectiveness). This merged composition achieves both complete adhesive removal and acceptable cleaning time without the drawbacks of using individual agents alone.
Solution Approach 2:
The cleaning composition is a composite formulation containing specific concentrations of organic solvent (70-95 wt%), alcohol (5-30 wt%), and alkaline substance (0.1-5 wt%). This composite material leverages the synergistic effects of different components to achieve superior cleaning performance that none of the individual components can provide alone.
2Reliability
If a cleaning agent is used to remove adhesive residues, then the substrate surface can be cleaned, but corrosion of the substrate surface may occur
Solution Approach 1:
The patent carefully controls the concentration parameters of each component to achieve effective cleaning while preventing corrosion. The organic solvent concentration is limited to 70-95 wt%, the alcohol to 5-30 wt%, and the alkaline substance to a low 0.1-5 wt%. These parameter constraints ensure the cleaning composition is effective yet gentle on the substrate.
Solution Approach 2:
The cleaning composition is designed to have different components perform specific localized functions: the organic solvent targets adhesive dissolution, the alcohol component targets silicone residue removal, and the alkaline substance provides enhanced cleaning. This differentiated local quality of each component allows effective cleaning without excessive harshness that would cause corrosion.
3Reliability
If the substrate is cleaned to fully remove adhesive, then the contact angle with water should be reduced, but existing cleaning agents cannot achieve this without causing corrosion
Solution Approach 1:
The alcohol component acts as an intermediary that bridges the gap between organic solvent and alkaline substance, enabling the removal of silicone-based adhesive residues that neither component could remove alone. The alcohol facilitates the action of the alkaline substance on silicone contaminants while being itself removable without causing substrate damage.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The cleaner composition efficiently removes contaminants from semiconductor substrates within a short time, reducing the water contact angle to less than 100° and preventing corrosion, thereby ensuring effective cleaning and preventing defects in subsequent processing steps.
Implementation Method 1
use of only an organic solvent for dissolving the adhesive is difficult to fully remove the residual adhesive
Implementation Method 2
0.1 to 10.0% by weight of an alcohol of 3 to 6 carbon atoms... capable of fully removing such contaminants
Data Source
AI summary
A cleaner composition consisting essentially of (A) 90.0-99.9 wt% of an organic solvent and (B) 0.1-10.0 wt% of a C3-C6 alcohol, and containing (C) 20-300 ppm of sodium and/or potassium is effective for cleaning a surface of a silicon semiconductor substrate. A satisfactory degree of cleanness is achieved within a short time and at a high efficiency without causing corrosion to the substrate.