Semiconductor Cleaning Composition Using Surfactant and Organic Compound
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Solution Overview
Problem
Current cleaning solutions for semiconductor devices, such as Standard Clean 1 (SC-1), are inefficient in removing fine process particles and can damage substrates due to high pressure, leading to incomplete cleaning and substrate contamination.
Innovation Solution
A cleaning composition and apparatus using a surfactant and organic compounds in specific concentrations, generating cleaning particles that absorb and remove fine process particles effectively without damaging the substrate, while maintaining low pressure and enhancing cleaning efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Power
If high pressure is used for cleaning substrates, then cleaning power is improved, but substrate damage increases
Solution Approach 1:
The patent replaces high-pressure mechanical cleaning with a chemical cleaning mechanism. The cleaning composition contains surfactants and organic compounds that chemically interact with and remove fine process particles from substrates without requiring high mechanical pressure, thereby eliminating substrate damage while maintaining effective cleaning power.
Solution Approach 2:
The patent changes the cleaning mechanism from mechanical (pressure-based) to chemical (composition-based). By optimizing the concentrations of surfactants (0.04-0.004 M) and organic compounds (0.17-0.57 M), the cleaning system achieves particle removal through chemical action rather than mechanical force, resolving the contradiction between cleaning power and substrate damage.
2Productivity
If conventional cleaning solutions are used, then cleaning process is simple, but fine process particle removal efficiency is low
Solution Approach 1:
The patent uses a composite cleaning composition containing multiple components: surfactants (0.04-0.004 M), organic compounds (0.17-0.57 M), and water. This composite formulation synergistically combines different chemical agents to achieve high fine particle removal efficiency that cannot be obtained with single-component conventional cleaners, accepting increased compositional complexity for dramatically improved productivity.
Solution Approach 2:
The surfactant acts as an intermediary substance that facilitates particle removal. It reduces surface tension and enables the organic compounds to effectively interact with and remove fine process particles from substrates, bridging the gap between the cleaning agents and the contaminants for enhanced removal efficiency.
3Productivity
If cleaning liquid temperature increases, then cleaning efficiency is improved, but particle generation increases
Solution Approach 1:
The patent optimizes the temperature parameter within a specific range (20-40°C) to balance cleaning efficiency and particle generation. This controlled temperature parameter change enables sufficient chemical reaction rates for effective particle removal while avoiding excessive thermal energy that would cause particle generation, achieving optimal cleaning performance without harmful side effects.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The proposed solution achieves higher cleaning efficiency for fine process particles compared to SC-1, with improved particle removal rates and reduced substrate damage, ensuring effective cleaning of semiconductor devices.
Implementation Method 1
generating cleaning particles that absorb and remove fine process particles effectively
Implementation Method 2
the cleaning liquid supply includes an electrical conductivity meter configured to measure the electrical conductivity of the cleaning liquid
Implementation Method 3
a thermostat configured to cool the cleaning liquid when the electrical conductivity of the cleaning liquid decreases
Data Source
AI summary
A cleaning composition, a cleaning apparatus, and a method of fabricating a semiconductor device, the cleaning composition including a surfactant; deionized water; and an organic compound, wherein the surfactant is included in the cleaning composition in a concentration of about 0.28 M to about 0.39 M or a mole fraction of about 0.01 to about 0.017, and wherein the organic compound is included in the cleaning composition in a concentration of about 7.1 M to about 7.5 M or a mole fraction of about 0.27 to about 0.35.