Semiconductor Cleaning Device Side Surface Foreign Matter Removal
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Solution Overview
Problem
Existing semiconductor cleaning devices are ineffective in removing foreign matter from the side surfaces of semiconductor devices and often result in re-adhesion of removed foreign matter, leading to issues like short-circuiting and defects during testing and evaluation.
Innovation Solution
A semiconductor cleaning device with an external electrode opposed to the side surface of the semiconductor device, a base with an opening below the side surface, and suction means connected to the base to remove foreign matter without re-adhesion, utilizing electrostatic attraction and suction to efficiently collect and discharge foreign particles.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If gas is blown against the transporting arm to remove foreign matter, then foreign matter can be removed from the transporting arm, but the blown gas scatters the foreign matter and causes it to adhere again without being removed
Solution Approach 1:
The patent introduces a suction device as an intermediary component to capture scattered foreign matter. The suction device creates a controlled airflow field that redirects scattered particles toward collection points, preventing them from settling on the transporting arm or other surfaces. This mediator approach transforms the harmful scattered airflow into a controlled collection mechanism.
Solution Approach 2:
The patent extracts the foreign matter removal function into a separate suction system independent from the gas blowing mechanism. By separating the removal action (suction) from the initial dislodgement action (gas blowing), the system can optimize each function independently - gas blowing for detachment and suction for immediate capture - preventing re-adhesion while maintaining effective removal.
2Strength
If an electrostatic chuck is used to attract the rear surface of the semiconductor wafer, then the wafer can be held securely, but it becomes difficult to remove foreign matter adhered to the side surface of the semiconductor wafer
Solution Approach 1:
The patent segments the cleaning function into multiple independent components: the electrostatic chuck handles wafer holding, while separate suction ports positioned around the wafer periphery handle side surface cleaning. This segmentation allows each component to perform its specialized function without interference - the chuck maintains holding force while suction ports independently remove side surface contaminants.
Solution Approach 2:
The patent transitions from planar cleaning (front surface only) to three-dimensional cleaning by positioning suction ports at the side surfaces and edges of the wafer. This spatial extension into the vertical and radial dimensions enables access to previously unreachable areas, allowing foreign matter removal from side surfaces while the electrostatic chuck continues to hold the wafer securely from the front surface.
3Manufacturing precision
If foreign matter is transferred onto a plate member from the electrostatically attracting and transporting arm, then foreign matter can be removed from the contacting portion, but it is impossible to remove foreign matter adhered to the side surface of the semiconductor wafer
Solution Approach 1:
The patent makes the suction system universal by positioning multiple suction ports to handle various types of foreign matter locations - front surface, side surfaces, and edges. The same suction mechanism that collects transferred foreign matter from the plate member also simultaneously captures particles from side surfaces, providing a unified solution for diverse contamination scenarios without requiring separate specialized systems.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Effectively removes foreign matter from side surfaces of semiconductor devices, preventing re-adhesion and improving contact resistance and electric properties, while allowing for efficient cleaning of multiple devices simultaneously.
Implementation Method 1
an external electrode opposed to a side surface of the semiconductor device... utilizing electrostatic attraction and suction to efficiently collect and discharge foreign particles
Implementation Method 2
suction means connected to the opening in the base and being capable of taking in the foreign matter through the opening
Data Source
AI summary
A semiconductor cleaning device includes an external electrode opposed to a side surface of the semiconductor device; a base configured to allow arrangement of the semiconductor device, and having an opening positioned between the side surface of the semiconductor device in the arranged state and the external electrode, and located below the side surface of the semiconductor device; a frame having an electrically insulating property, being in contact with the external electrode, arranged on the base and opposed to the side surface of the semiconductor device; and suction means connected to the opening in the base and being capable of taking in the foreign matter through the opening. Thereby, the semiconductor cleaning device and a semiconductor cleaning method that can remove the foreign matter adhered to the side surface of the semiconductor device and can prevent re-adhesion of the removed foreign matter can be obtained.