Semiconductor Cleaning Composition for Silicone Adhesive Removal
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Solution Overview
Problem
Existing cleaning agent compositions struggle to effectively remove silicone-containing temporary adhesive materials from semiconductor substrates, leading to incomplete cleaning and potential interference in subsequent semiconductor processing.
Innovation Solution
A cleaning agent composition comprising a quaternary ammonium salt and an acid amide compound, optionally with a non-polar solvent and ether component, is used to enhance detergency and permeability, ensuring complete removal of silicone-containing adhesives.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional cleaning agent compositions are used, then the cleaning process is simple, but the cleaning effectiveness is insufficient and silicone-containing adhesive materials cannot be completely removed
Solution Approach 1:
The patent applies composite materials by formulating a cleaning agent composition containing multiple specific components: quaternary ammonium salt (0.1-20 mass%), acid amide compound (10-50 mass%), and water (50-89.9 mass%). This composite composition synergistically combines different chemical substances to achieve effective removal of silicone-containing adhesive materials, resolving the contradiction between cleaning effectiveness and composition simplicity.
Solution Approach 2:
The patent applies parameter changes by optimizing the concentration ranges of each component in the cleaning agent composition. Specifically, it controls quaternary ammonium salt at 0.1-20 mass%, acid amide compound at 10-50 mass%, and water at 50-89.9 mass%. These parameter optimizations enable effective cleaning while maintaining composition manageability, addressing the contradiction between cleaning reliability and composition complexity.
2Reliability
If the cleaning agent composition contains multiple components, then the detergency and permeability are improved, but the composition becomes more complex
Solution Approach 1:
The patent optimizes the concentration parameters of each component to achieve effective detergency. It specifies quaternary ammonium salt at 0.1-20 mass%, acid amide compound at 10-50 mass%, and water at 50-89.9 mass%. These controlled parameter ranges ensure sufficient cleaning performance while keeping the composition structure manageable and not excessively complex.
3Reliability
If water content is increased, then the detergency is enhanced, but the permeability of the cleaning agent may be reduced
Solution Approach 1:
The patent optimizes the water content parameter within a specific range of 50-89.9 mass% of the total composition. This parameter optimization balances detergency enhancement with maintained permeability, ensuring that the cleaning agent can effectively penetrate and remove adhesive materials while providing sufficient cleaning action through adequate water content.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The composition achieves thorough cleaning of silicone adhesives, maintaining substrate cleanliness for subsequent semiconductor processing, with improved permeability and detergency.
Implementation Method 1
a cleaning agent composition comprising (1) a quaternary ammonium salt and (2) an acid amide compound... ensuring complete removal of silicone-containing adhesives... with improved permeability and detergency
Data Source
AI summary
Provided is a cleaning agent composition for semiconductor cleaning, containing: a quaternary ammonium salt; and an acid amide compound represented by Chemical Formula 1. Here, R1 to R3 are organic groups, R1 contains at least one heteroatom, and Chemical Formula 1 does not include a cyclic structure in which two or more selected from R1 to R3 are linked. Provided is a method of cleaning a semiconductor substrate, including applying the cleaning agent composition to a semiconductor substrate in which a silicone-containing temporary adhesive material remains on at least one surface to clean the semiconductor substrate.