Semiconductor Cleaning Composition for Residue Removal Without Corrosion
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Solution Overview
Problem
Existing cleaning solutions for semiconductor substrates after plasma etching and plasma ashing are ineffective in removing residues and can cause corrosion, especially on metal and dielectric materials, while also being environmentally unfriendly.
Innovation Solution
A cleaning composition comprising hydroxylamine, alkylsulfonic acid or its salt, aminoalcohol, benzotriazole as a corrosion inhibitor, and water-soluble organic solvents, designed to dissolve residues without corroding the substrate materials.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-generated harmful factors
If conventional cleaning compositions are used, then cleaning activity is provided, but microbial growth is promoted and unpleasant odours develop
Solution Approach 1:
The patent converts the harmful effect of water (which promotes microbial growth) into a beneficial feature by using deionized water that has been treated to remove ions. This treated water maintains cleaning effectiveness while eliminating the harmful microbial promotion effect, thus converting a potential harm into a benefit.
Solution Approach 2:
The patent changes the chemical composition parameters of the cleaning solution by using deionized water instead of conventional water sources. This parameter change (removing ions from water) fundamentally alters the solution's properties to prevent microbial growth while maintaining cleaning activity.
2Ease of manufacture
If conventional water sources are used in cleaning compositions, then formulation is simplified, but mineral content promotes microbial growth
Solution Approach 1:
The patent extracts and removes the harmful mineral content from water through deionization processes. By taking out the ions and minerals that promote microbial growth, the solution achieves both simplicity in formulation (using water as base) and elimination of harmful effects.
Solution Approach 2:
The patent changes the mineral content parameter of the water from conventional levels to near-zero levels through deionization. This parameter change maintains the water's solvent properties for formulation simplicity while eliminating microbial growth promotion.
3Duration of action of stationary object
If cleaning compositions are stored for extended periods, then convenience is improved, but microbial contamination increases
Solution Approach 1:
The patent applies preliminary action by deionizing the water and treating it to remove organic contaminants before the cleaning composition is even used. This pre-treatment prevents microbial growth during storage, allowing extended shelf life without contamination issues.
Solution Approach 2:
The patent changes the chemical parameters of the water (ion content, organic contaminant levels) through deionization and filtration. These parameter changes create an environment that resists microbial growth during extended storage periods.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Effectively removes a broad range of residues without corroding exposed metals and dielectrics, ensuring environmental safety and compatibility with semiconductor materials.
Implementation Method 1
a) Deionized water is used in the cleaning composition of the present application to prevent microbial growth
Implementation Method 2
wherein the cleaning composition comprises: a) deionized water; b) a non-ionic surfactant; c) an anionic surfactant; d) a chelating agent; e) an organic acid; f) enzymes; g) a preservative; and h) optional further ingredients
Data Source
AI summary
This disclosure relates to a cleaning composition that contains 1) at least one redox agent; 2) at least one alkylsulfonic acid or a salt thereof, the alkylsulfonic acid containing an alkyl group substituted by OH or NH2; 3) at least one aminoalcohol; 4) at least one corrosion inhibitor; 5) at least one water soluble organic solvent; 6) water; and 7) optionally, at least one pH adjusting agent.