Self-Locking Clip Structure for Semiconductor Die Package Alignment
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Solution Overview
Problem
Semiconductor die packages using conductive clip structures often suffer from misalignment issues due to the lack of an alignment mechanism, leading to increased costs and the need for rework.
Innovation Solution
Incorporating a clip aligner structure cooperatively structured with the lead's flat surface, which stabilizes the position of the clip structure through an intermediate portion, ensuring precise alignment and secure bonding.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If a conventional clip structure is used without an alignment mechanism, then the manufacturing process is simple, but the manufacturing precision deteriorates causing misalignment in the final package
Solution Approach 1:
The clip structure is divided into distinct functional segments: a contact portion for electrical connection, an intermediate portion for mechanical coupling, and a clip aligner structure for positioning. This segmentation allows each part to perform its specific function optimally while maintaining overall simplicity
Solution Approach 2:
The intermediate portion acts as an intermediary element that couples the contact portion and the clip aligner structure. This mediator enables the integration of alignment functionality without requiring a completely complex new structure, bridging the simple contact function with the alignment function
2Reliability
If a conventional clip structure without alignment mechanism is used, then the device complexity is low, but the reliability deteriorates due to misalignment and need for rework
Solution Approach 1:
The clip aligner structure performs preliminary alignment action during the assembly process, positioning the contact portion correctly relative to the lead before final bonding occurs. This preliminary positioning prevents misalignment issues and eliminates the need for rework, improving reliability
Solution Approach 2:
The clip aligner structure provides self-alignment functionality, where the structure itself performs the alignment task during assembly without requiring external alignment mechanisms or additional processing steps. The cooperatively structured features automatically guide proper positioning
Data Source
AI summary
A semiconductor die package. The semiconductor die package includes a semiconductor die, and a lead comprising a flat surface. It also includes a clip structure including a (i) a contact portion, where the contact portion is coupled the semiconductor die, a clip aligner structure, where the clip aligner structure is cooperatively structured with the lead with the flat surface, and an intermediate portion coupling the contact portion and the clip aligner structure.