Semiconductor Clip With Alignment Features For Die And Lead Frame
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing semiconductor packages face challenges in achieving reliable electrical connections and thermal performance due to the limitations of wire bonding, and there is a need for an alternative that ensures stable alignment and bonding during reflow and adhesive die attach curing processes.
Innovation Solution
A clip-based semiconductor package design featuring a die attach portion with protrusions and a lead frame alignment portion with alignment features that form an interlocking mechanism, preventing movement during critical processes, and ensuring proper alignment and bonding through protrusions and recesses, and alignment features that couple into holes and openings in the lead frame.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If wire bonding is used for electrical connection, then the connection can be established, but the thermal performance and reliability are insufficient
Solution Approach 1:
The patent replaces the wire bonding mechanical system with a clip-based mechanical compression system. The clip applies direct mechanical pressure between the die and lead frame, eliminating the need for wire bonds and providing both electrical connection and improved thermal contact through direct metal-to-metal compression.
Solution Approach 2:
The clip structure combines different materials (conductive metal for electrical connection, compression-applying material for mechanical force) to simultaneously achieve electrical connectivity and thermal management in a single integrated component rather than separate wire bond and thermal interface solutions.
2Manufacturing precision
If a clip structure is introduced to improve alignment, then the alignment precision improves, but the device complexity increases
Solution Approach 1:
The patent merges multiple functions into the clip structure: alignment features (protrusions and recesses) are integrated directly into the clip body, combining positioning and compression functions in a single component rather than separate alignment fixtures and compression elements.
Solution Approach 2:
The clip's alignment features (protrusions fitting into recesses) enable self-alignment during assembly, allowing the clip to automatically position itself correctly relative to the die and lead frame without requiring external alignment tools or complex positioning mechanisms.
3Reliability
If the clip prevents movement during reflow and curing, then the bonding reliability improves, but the manufacturing process complexity increases
Solution Approach 1:
The clip is installed and configured to prevent movement before the reflow and curing processes begin. The alignment features and compression structure are pre-established to maintain fixed positioning throughout the subsequent thermal and chemical processing steps, ensuring bonding reliability without requiring complex in-process control.
Data Source
AI summary
Implementations of a clip may include a die attach portion including at least one protrusion extending from the die attach portion and a lead frame alignment portion including at least one alignment feature. The at least one alignment feature may be configured to couple into at least one hole in a lead frame thereby aligning the clip with the lead frame. The at least one protrusion may be configured to couple into at least one recess in the die.