Semiconductor Clip Contact for Cost-Effective Miniaturization
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Current semiconductor packaging methods are costly and inefficient, particularly in achieving small component sizes at low expenses, which hinders the manufacturing of high-performance semiconductor devices.
Innovation Solution
The use of a contact clip with a bond portion, intermediate portion, and terminal portion, made from materials like Cu, Ni, or their alloys, to electrically connect semiconductor chip electrodes to external terminals, integrated into the packaging process, allowing for efficient encapsulation and miniaturization of semiconductor devices.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If conventional packaging methods are used, then electrical connection is achieved, but manufacturing cost increases and component size increases
Solution Approach 1:
The contact clip merges multiple functions into a single component: it provides electrical connection between the semiconductor chip and external terminals, serves as a structural support element, and enables packaging encapsulation. This consolidation eliminates the need for separate bond layers and multiple discrete connection elements, thereby reducing both manufacturing cost and component size while maintaining electrical connectivity.
2Reliability
If additional bond layers are used for connection, then electrical connection reliability is improved, but manufacturing complexity and cost increase
Solution Approach 1:
The invention extracts and eliminates the unnecessary bond layers from the conventional packaging structure. The contact clip directly contacts the semiconductor chip electrodes and provides electrical connection without requiring intermediate bond layers, thereby simplifying the packaging structure while maintaining connection reliability through direct metal-to-chip contact.
3Area of moving object
If chip area is increased for better performance, then device performance improves, but packaging cost and complexity increase
Solution Approach 1:
The contact clip serves multiple functions simultaneously: it provides electrical connection, structural support, and enables efficient packaging of larger chip areas. By making the contact clip multi-functional, the invention allows for increased chip area to accommodate higher performance requirements without proportionally increasing packaging cost or complexity, as the same contact clip structure handles multiple tasks.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution reduces packaging costs and enables the production of smaller, high-performance semiconductor devices by providing a cost-effective and efficient method for connecting semiconductor chip electrodes to external terminals, promoting miniaturization and increasing chip area without the need for additional bond layers.
Implementation Method 1
a contact clip (103) comprising a bond portion (103_1), an intermediate portion (103_2) and a terminal portion (103_3)... to electrically connect semiconductor chip electrodes to external terminals
Data Source
AI summary
A semiconductor device comprises a carrier. Further, the semiconductor devices comprises a semiconductor chip comprising a first main surface and a second main surface opposite to the first main surface, wherein a first electrode is arranged on the first main surface and the semiconductor chip is mounted on the carrier with the second main surface facing the carrier. Further, an encapsulation body embedding the semiconductor chip is provided. The semiconductor device further comprises a contact clip, wherein the contact clip is an integral part having a bond portion bonded to the first electrode and having a terminal portion forming an external terminal of the semiconductor device.